3D thermoelasticity solutions for functionally graded thick plates

Journal of Zhejiang University: Science A

Volumn 10, Issue 3, 2009, Pages 327-336

  Ying, Ji ^a   Lü, Chao Feng ^a   Lim, C W ^b  

^a ZHEJIANG UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

3D thermoelasticity; Functionally graded plates; Mori Tanaka method; Semi analytical solutions

Indexed keywords

BOUNDARY CONDITIONS; ELASTICITY; LAMINATES; PLATES (STRUCTURAL COMPONENTS); THERMAL CONDUCTIVITY; THERMOELASTICITY; THREE DIMENSIONAL; TITRATION;

3D THERMOELASTICITY; APPROXIMATE LAMINATE MODELS; ARBITRARY BOUNDARY CONDITIONS; CO-EFFICIENT OF THERMAL EXPANSIONS; CONSTANT COEFFICIENTS; DIFFERENTIAL QUADRATURES; EFFECTIVE MATERIAL PROPERTIES; FUNCTIONALLY GRADED; FUNCTIONALLY GRADED PLATES; GRADIENT INDICES; HYBRID APPROACHES; INHOMOGENEOUS PLATES; MORI-TANAKA METHOD; OPPOSITE EDGES; POWER LAWS; SEMI-ANALYTICAL SOLUTIONS; SHEAR MODULUS; SIMPLY SUPPORTED; STATE EQUATIONS; STATE-SPACE ANALYSIS; TEMPERATURE FIELDS; THERMAL CONDUCTIONS; THERMAL-MECHANICAL BEHAVIORS; THERMO-MECHANICAL BEHAVIORS; THICK PLATES; THICKNESS DIRECTIONS; VOLUME FRACTION PROFILES;

THERMAL EXPANSION;

EID: 62349104059     PISSN: 1673565X     EISSN: 18621775     Source Type: Journal    
DOI: 10.1631/jzus.A0820406     Document Type: Article

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