High-level embedded passive triplexer and quintplexer module into organic packaging substrate

Proceedings of the 38th European Microwave Conference, EuMC 2008

Volumn , Issue , 2008, Pages 638-641

  Lim, Sung P ^a   Cheon, Seong J ^a   Bang, Dong H ^a   Park, Jae Y ^a  

^a Kwangwoon University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE FILTERS; CHIP SCALE PACKAGES; CODE DIVISION MULTIPLE ACCESS; ELECTRONIC EQUIPMENT MANUFACTURE; MICROWAVES; SUBSTRATES;

BAND PASS FILTERS; DIPLEXER; DUPLEXERS; EMBEDDED PASSIVES; EVALUATION BOARDS; FABRICATED DEVICES; LOW COSTS; MATCHING NETWORKS; MULTI-LAYERED; ORGANIC PACKAGING; PACKAGING SUBSTRATES; PASSIVE ELEMENTS; PERFORMANCE CHARACTERISTICS; SIMULATED PERFORMANCE; SURFACE MOUNTINGS; TRIPLEXER;

MULTIPLEXING EQUIPMENT;

EID: 62349093288     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2008.4751533     Document Type: Conference Paper

References (5)

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