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Volumn 65, Issue 1, 2009, Pages 104-108

Analysis of non-load bearing, 2 component epoxy-adhesive to the hemming process variations; Thermo-Gravimetric, Differential Scanning Calorimetry, and Fourier Transform Infrared Spectroscopy FT-IR analyses

Author keywords

2K adhesives; DSC; FTIR; Hemming variations; TGA; Volatile evaporation

Indexed keywords

ADHESIVES; ATMOSPHERIC HUMIDITY; BEARINGS (STRUCTURAL); CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; EVAPORATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; LASER INTERFEROMETRY; RESINS; SCANNING; SPECTROSCOPIC ANALYSIS; SPECTRUM ANALYSIS; THERMOGRAVIMETRIC ANALYSIS; VAPORS;

EID: 62049084175     PISSN: 03009440     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.porgcoat.2008.10.002     Document Type: Article
Times cited : (4)

References (9)
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    • Determination of dynamic shear modulus of structural adhesives in thick adherend shear test specimens
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    • (2002) International Journal of Adhesion and Adhesives , vol.22 , pp. 119-127
    • Maheri, M.R.1    Adams, R.D.2
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    • Specular reflectance and derivative spectrometric resind on lac-resin blends
    • Bhatia D., Alam M., and Sarkar P. Specular reflectance and derivative spectrometric resind on lac-resin blends. Pigment and Resin Technology 36 No. 1 (2006) 18-29
    • (2006) Pigment and Resin Technology , vol.36 , Issue.1 , pp. 18-29
    • Bhatia, D.1    Alam, M.2    Sarkar, P.3
  • 8
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    • Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood
    • Jiang H., and Kamdem D.P. Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood. Wood Science and Technology 41 (2007) 637-644
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    • Jiang, H.1    Kamdem, D.P.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.