Characterization of parylene-N as flexible substrate and passivation layer for microwave and millimeter-wave integrated circuits

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 1, 2009, Pages 84-92

  Sharifi, Hasan ^a   Lahiji, Rosa R ^a   Lin, Han Chung ^a   Ye, Peide D ^a   Katehi, Linda P B ^b   Mohammadi, Saeed ^a  

^a Purdue University   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Dielectric characterization; Microwave and millimeter wave integrated circuit; Parylene; Passivation; Ring resonators

Indexed keywords

ATMOSPHERIC HUMIDITY; BANDPASS FILTERS; COPLANAR WAVEGUIDES; DIELECTRIC MATERIALS; ELECTRIC LINES; ELECTRIC PROPERTIES; HUMIDITY CONTROL; INTEGRATED CIRCUITS; MICROWAVES; MILLIMETER WAVES; MOISTURE; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; OPTICAL RESONATORS; POWER TRANSMISSION; RESONATORS; SUBSTRATES; TRANSMISSION LINE THEORY;

ACTIVE STRUCTURES; BEFORE AND AFTER; COPLANAR WAVEGUIDE TRANSMISSION LINES; DEW POINT SENSORS; DIELECTRIC CHARACTERIZATION; ELECTRICAL PROPERTIES; FLEXIBLE SUBSTRATES; FREQUENCY SHIFTS; GAAS; LOSS TANGENTS; MEASUREMENT ACCURACIES; MESFETS; MICROSTRIP RING RESONATORS; MILLIMETER-WAVE FREQUENCIES; MULTI-LAYER DIELECTRICS; PARYLENE; PARYLENE-N; PASSIVATION LAYERS; PROMISING MATERIALS; RELATIVE DIELECTRIC CONSTANTS; RELATIVE HUMIDITIES; RF PERFORMANCE; RING RESONATORS; TRANSMISSION LINES;

PASSIVATION;

EID: 61649111176     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.2006760     Document Type: Article

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