Adhesion of Rhodococcus sp. S3E2 and Rhodococcus sp. S3E3 to plasma prepared Teflon-like and organosilicon surfaces

Journal of Materials Processing Technology

Volumn 209, Issue 6, 2009, Pages 2871-2875

  Lehocký, Marián ^a   Sťahel, Pavel ^b   Koutný, Marek ^a   Čech, Jan ^b   Institoris, Jakub ^b   Mráček, Aleš ^a  

^a TOMAS BATA UNIVERSITY IN ZLIN   (Czech Republic)

^b MASARYK UNIVERSITY   (Czech Republic)

Author keywords

Barrier discharge; Cell adhesion; Plasma deposition; Rhodococcus; Thin films

Indexed keywords

ADHESION; ANGLE MEASUREMENT; ATMOSPHERIC PRESSURE; ATOMIC SPECTROSCOPY; BIOLOGICAL MATERIALS; CELL ADHESION; CHEMICAL VAPOR DEPOSITION; CONTACT ANGLE; ELECTRIC DISCHARGES; ELECTRODEPOSITION; EMISSION SPECTROSCOPY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GAS PERMEABLE MEMBRANES; MOLECULAR SPECTROSCOPY; OPTICAL EMISSION SPECTROSCOPY; PLASMA DIAGNOSTICS; PLASMAS; SULFUR COMPOUNDS; SURFACE PROPERTIES; THIN FILMS;

ADHESION STUDIES; BACTERIAL STRAINS; BARRIER DISCHARGE; CARRIER GAS; CELL ATTACHMENTS; CONTACT-ANGLE MEASUREMENTS; DEPOSITED LAYERS; FLOW RATE RATIOS; FT-IR SPECTROSCOPIES; ORGANOSILICON; ORGANOSILICON THIN FILMS; PAPER SUBSTRATES; PLASMA PARAMETERS; PRESSURE SURFACES; PROPERTIES OF DEPOSITED FILMS; RHODOCOCCUS; RHODOCOCCUS SP;

PLASMA DEPOSITION;

EID: 61549133600     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.06.042     Document Type: Article

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