Semiconductor on diamond (SOD) for system on chip (SoC) architectures

2006 Proceedings - 23rd International VLSI Multilevel Interconnection Conference, VMIC 2006

Volumn , Issue , 2006, Pages 35-38

  Sung, James C ^a,b,c   Kan, Ming Chi ^a   Hu, Shao Chung ^a   Sung, Michael ^a,d   Monteith, Barnas G ^a,d  

^a KINIK Company   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^c NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^d Advanced Diamond Solutions Inc   (United States)

Author keywords

Diamond Film; Heat Spreader; SOD; SOI; Thermal conductivity; ULSI

Indexed keywords

HEAT DISSIPATION CAPABILITY; HEAT SPREADERS; HIGH PERFORMANCE SYSTEMS; SEMICONDUCTOR SUBSTRATE; SOD; SOI; SYSTEM-ON-CHIP ARCHITECTURE; ULSI;

DIAMOND FILMS; THERMAL CONDUCTIVITY;

PROGRAMMABLE LOGIC CONTROLLERS;

EID: 61549109417     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. C. M. Sung, "Wurtzitic Boron Nitride on Diamond: The Ultimate Epitomical Wafer for Semiconductor on Insulator", ADC/NanoCarbon 2005, Chicago, Illinois, U.S.A
2. C. M. Sung, "Wurtzitic Boron Nitride on Diamond: The Ultimate Epitaxial Wafer for "Semiconductor on Insulator", NSTI-Nanotech 2005, Anaheim, California, U.S.A., 2, p.377-380