Three-dimensional numerical simulation for annular condensation in rectangular microchannels

Nanoscale and Microscale Thermophysical Engineering

Volumn 13, Issue 1, 2009, Pages 13-29

  Wu, Jiafeng ^a   Chen, Yongping ^a   Shi, Mingheng ^a   Fu, Panpan ^a   Peterson, G P ^b  

^a SOUTHEAST UNIVERSITY   (China)

^b UCB 450   (United States)

Author keywords

Annular condensation; Rectangular microchannel; Simulation

Indexed keywords

CONDENSATION; HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; MAGNETIC FILMS; MOLECULAR BEAM EPITAXY; SURFACE TENSION; THIN FILM DEVICES; THREE DIMENSIONAL; WALL FLOW;

ANNULAR CONDENSATION; ANNULAR FLOWS; CONDENSATE FILMS; CONDENSATE FLOWS; CONSTANT HEAT FLUXES; CROSS SECTIONS; CURVATURE RADIUS; LOCAL HEAT TRANSFER COEFFICIENTS; MASS EQUATIONS; PROFILE SHAPES; RECTANGULAR MICROCHANNEL; SIDE WALLS; SIMULATION; THICKNESS EQUATIONS; THIN-FILM; THREE-DIMENSIONAL MODELS; THREE-DIMENSIONAL NUMERICAL SIMULATIONS; WALL TEMPERATURES;

MICROCHANNELS;

EID: 61449085720     PISSN: 15567265     EISSN: None     Source Type: Journal    
DOI: 10.1080/15567260802625882     Document Type: Article

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