SCOPUS 정보 검색 플랫폼

Sensors and Actuators, A: Physical

Volumn 150, Issue 2, 2009, Pages 267-271

Lead-free alkaline niobate-based transducer for ultrasonic wirebonding applications

(4) Lee, Tact a,b Kwok, K W a Li, H L b Chan, H L W a

a HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

b ASM Assembly Automation Ltd (Hong Kong)

Author keywords

Lead free piezoelectric ceramics; Ultrasonic transducers; Wirebonding applications

Indexed keywords

ACOUSTIC IMPEDANCE; ALUMINA; APPLICATIONS; ELECTROACOUSTIC TRANSDUCERS; MANGANESE COMPOUNDS; NIOBIUM; NIOBIUM COMPOUNDS; PIEZOELECTRIC ACTUATORS; PIEZOELECTRIC CERAMICS; PIEZOELECTRICITY; POLYCHLORINATED BIPHENYLS; SEMICONDUCTING LEAD COMPOUNDS; SODIUM; TANTALUM; TITANIUM; TITANIUM ALLOYS; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC TRANSDUCERS; ULTRASONIC WAVES; ULTRASONICS; WIRE;

ALKALINE NIOBATE; ALUMINUM WIRES; AXIAL VIBRATIONS; BOND STRENGTHS; DEFORMATION RATIOS; FUTURE GENERATIONS; INDUSTRIAL REQUIREMENTS; LATERAL VIBRATIONS; LEAD ZIRCONATE TITANATES; LEAD-FREE; LEAD-FREE PIEZOELECTRIC CERAMICS; PZT TRANSDUCERS; VIBRATION ENERGIES; WIRE BONDERS; WIREBONDING APPLICATIONS;

PIEZOELECTRIC TRANSDUCERS;

EID: 61449083518 PISSN: 09244247 EISSN: None Source Type: Journal
DOI: 10.1016/j.sna.2009.01.010 Document Type: Article

Times cited : (27)

References (11)

1
- 1242310336
- Large piezoelectric constant and high Curie temperature of lead-free piezoelectric ceramic ternary system based on bismuth sodium titanate-bismuth potassium titanate-barium titanate near the morphotropic phase boundary
- Nagata H., Yoshida M., Makiuchi Y., and Takenaka T. Large piezoelectric constant and high Curie temperature of lead-free piezoelectric ceramic ternary system based on bismuth sodium titanate-bismuth potassium titanate-barium titanate near the morphotropic phase boundary. Jpn. J. Appl. Phys. 42 (2003) 7401-7403
- (2003) Jpn. J. Appl. Phys. , vol.42 , pp. 7401-7403
- Nagata, H.¹ Yoshida, M.² Makiuchi, Y.³ Takenaka, T.⁴

2
- 3242689017
- 3 lead-free piezoelectric ceramics
- 3 lead-free piezoelectric ceramics. Appl. Phys. Lett. 85 1 (2004) 91-93
- (2004) Appl. Phys. Lett. , vol.85 , Issue.1 , pp. 91-93
- Wang, X.X.¹ Tang, X.G.² Chan, H.L.W.³

3
- 33745138582
- 3 transducer for ultrasonic wirebonding applications
- 3 transducer for ultrasonic wirebonding applications. Appl. Phys. A-Mater. Sci. Proc. 84 (2006) 313-316
- (2006) Appl. Phys. A-Mater. Sci. Proc. , vol.84 , pp. 313-316
- Choy, S.H.¹ Wang, X.X.² Chong, C.P.³ Chan, H.L.W.⁴ Liu, P.C.K.⁵ Choy, C.L.⁶

4
- 43449125874
- Bismuth sodium titanate based lead-free ultrasonic transducer for microelectronics wirebonding applications
- Chan H.L.W., Choy S.H., Chong C.P., Li H.L., and Li P.C.K. Bismuth sodium titanate based lead-free ultrasonic transducer for microelectronics wirebonding applications. Ceram. Int. 34 (2009) 773-777
- (2009) Ceram. Int. , vol.34 , pp. 773-777
- Chan, H.L.W.¹ Choy, S.H.² Chong, C.P.³ Li, H.L.⁴ Li, P.C.K.⁵

5
- 84978600371
- Hot pressing of potassium-sodium niobates
- Jaeger R.E., and Egerton L. Hot pressing of potassium-sodium niobates. J. Am. Ceram. Soc. 45 (1963) 209-213
- (1963) J. Am. Ceram. Soc. , vol.45 , pp. 209-213
- Jaeger, R.E.¹ Egerton, L.²

6
- 27344458378
- 3 ceramics
- 3 ceramics. Appl. Phys. Lett. 87 (2005) 182905
- (2005) Appl. Phys. Lett. , vol.87 , pp. 182905
- Hollenstein, E.¹ Davis, M.² Damjanovic, D.³ Setter, N.⁴

7
- 33744733985
- 3 piezoelectric ceramics with a sintering aid of CuO
- 3 piezoelectric ceramics with a sintering aid of CuO. J. Am. Ceram. Soc. 89 (2006) 1951-1956
- (2006) J. Am. Ceram. Soc. , vol.89 , pp. 1951-1956
- Takao, H.¹ Saito, Y.² Aoki, Y.³ Horibuchi, K.⁴

8
- 8544284589
- Lead-free piezoceramics
- Saito Y., Takao H., Tani T., Nonoyama T., Takatori K., Homma T., Nagaya T., and Nakamur M. Lead-free piezoceramics. Nature 432 (2004) 84-87
- (2004) Nature , vol.432 , pp. 84-87
- Saito, Y.¹ Takao, H.² Tani, T.³ Nonoyama, T.⁴ Takatori, K.⁵ Homma, T.⁶ Nagaya, T.⁷ Nakamur, M.⁸

9
- 49749130438
- 3 lead-free ceramics
- 3 lead-free ceramics. J. Phys. D: Appl. Phys. 41 15 (2008) 155402
- (2008) J. Phys. D: Appl. Phys. , vol.41 , Issue.15 , pp. 155402
- Lee, T.¹ Kwok, K.W.² Chan, H.L.W.³

10
- 61449164091
- MPhil Thesis, The Hong Kong Polytechnic University
- T. Lee, Development of lead-free ultrasonic wirebonding transducers for microelectronic packaging applications, MPhil Thesis, The Hong Kong Polytechnic University, 2008.
- (2008) Development of lead-free ultrasonic wirebonding transducers for microelectronic packaging applications
- Lee, T.¹

11
- 4344575963
- Study of 1-3 composite transducer for ultrasonic wirebonding application
- Chong C.P., Li H.L., Chan H.L.W., and Liu P.C.K. Study of 1-3 composite transducer for ultrasonic wirebonding application. Ceram. Int. 30 (2004) 1141-1146
- (2004) Ceram. Int. , vol.30 , pp. 1141-1146
- Chong, C.P.¹ Li, H.L.² Chan, H.L.W.³ Liu, P.C.K.⁴

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