Identification of affecting factors of copper sulfide deposition on insulating paper in oil

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 16, Issue 1, 2009, Pages 265-272

  Amimoto, T ^a   Nagao, E ^a   Tanimura, J ^a   Toyama, S ^a   Fujita, Y ^a   Kawarai, H ^a   Yamada, N ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Copper; Copper compounds; Oil insulation; Paper insulation; Sulfur; Sulfur compounds; Transformers

Indexed keywords

ATMOSPHERIC TEMPERATURE; COPPER; COPPER COMPOUNDS; DEPOSITION; DEPOSITION RATES; DISSOLUTION; ELECTRIC TRANSFORMER INSULATION; INSULATING MATERIALS; INSULATING OIL; INSULATION; SULFUR; SULFUR COMPOUNDS; SULFUR DETERMINATION; TESTING; THERMAL AGING;

AFFECTING FACTORS; COPPER DISSOLUTIONS; COPPER SULFIDES; HEATING TEMPERATURES; INCUBATION PERIODS; INSULATING PAPERS; NITROGEN ATMOSPHERES; OIL INSULATION; PAPER INSULATION; THERMAL-AGING TESTS; TRANSFORMERS;

PAPER;

ATMOSPHERE; COPPER COMPOUNDS; DEPOSITION; HEATING; IDENTIFICATION; INSULATING PAPERS; NITROGEN; OIL; QUANTITATIVE ANALYSIS; SULFIDES; SULFUR COMPOUNDS; TESTING; THERMAL ANALYSIS; TRANSFORMERS;

EID: 61349116316     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2009.4784576     Document Type: Article

References (10)

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