Mechanical damping using adhesive micro or nano powders

Powder Technology

Volumn 191, Issue 1-2, 2009, Pages 143-148

  Severson, B L ^a   Keer, L M ^a   Ottino, J M ^a   Snurr, R Q ^a  

^a Northwestern University   (United States)

Author keywords

Adhesion; JKR; Particle damping; Particle dynamics

Indexed keywords

ADHESION FORCES; ADHESION HYSTERESIS; ADHESIVE CONTACTS; ADHESIVE PARTICLES; ADHESIVE PROPERTIES; DAMPING DEVICES; DAMPING MECHANISMS; DEVICE GEOMETRIES; JKR; MECHANICAL DAMPING; NANO POWDERS; PACKING DENSITIES; PARTICLE DAMPING; PARTICLE DYNAMICS; PARTICLE DYNAMICS SIMULATIONS; PARTICLE LOADINGS; SMALL PARTICLES; TEMPERATURE-INSENSITIVE OPERATIONS; VISCOUS FLUIDS;

ADHESION; DAMPING; ELASTICITY; HYSTERESIS; POWDERS; UNLOADING; VIBRATIONS (MECHANICAL);

DYNAMICS;

EID: 60449090908     PISSN: 00325910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.powtec.2008.09.019     Document Type: Article

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