300-mm wafer isolation technology: Lessons from the 200-mm generation

Solid State Technology

Volumn 39, Issue 2, 1996, Pages 77-81

  Fosnight, William ^a,b   Martin, Raymond ^a,c   Bonora, Anthony ^a,d  

^a Asyst Technologies Inc   (United States)

^b OHIO STATE UNIVERSITY   (United States)

^c SANTA CLARA UNIVERSITY   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 6044228439     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. SEMI draft standard 2471A; Provisional mechanical spec, for cassettes used to transport and store wafers.
2. SEMI draft standard 2470A; Provisional mechanical spec. for kinematic couplings used to align and support 200-mm and 300-mm wafer carriers.
3. A. Slocum, "Design of Three-Groove Kinematic Couplings," Precision Engineering, vol. 14, no. 2, pp. 67-76 (April 1992).
4. SEMI Draft Standard 2472A; Provisional mechanical spec, for boxes and pods used to transport and store 300-mm wafers.
5. SEMI Draft Standard 2469; Specification for 300-mm bottom-opening standard mechanical interface (SMIF).
6. Minutes, "Front-opening pod SEMI standards meeting (July 27-28 1995).
7. SEMI Draft Standard; Provisional spec, for 300-mm tool loadport.