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Volumn 587-588, Issue , 2008, Pages 443-447
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Bulk copper-nanodiamond nanocomposites; processing and properties
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Author keywords
Composite materials; Nanodiamond; Nanostructured copper
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Indexed keywords
COMPOSITE MATERIALS;
COPPER;
DISINTEGRATION;
GLASS CERAMICS;
HARDNESS;
HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY;
METALLIC MATRIX COMPOSITES;
NANOCOMPOSITES;
PLASTICS APPLICATIONS;
POWDER METALS;
THERMAL ENGINEERING;
ENGINEERING MATERIALS;
EXTRUDED MATERIALS;
FUNCTIONAL PROPERTIES;
HIGH CONDUCTIVITY;
NANO-DIAMOND PARTICLES;
NANOSTRUCTURED COPPER;
NANOSTRUCTURED METALS;
PROCESSING AND PROPERTIES;
NANODIAMONDS;
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EID: 60349118644
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: 10.4028/www.scientific.net/msf.587-588.443 Document Type: Conference Paper |
Times cited : (9)
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References (13)
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