Sintered porous heat sink for cooling of high-powered microprocessors for server applications

International Journal of Heat and Mass Transfer

Volumn 52, Issue 9-10, 2009, Pages 2289-2299

  Singh, Randeep ^a   Akbarzadeh, Aliakbar ^a   Mochizuki, Masataka ^b  

^a RMIT UNIVERSITY   (Australia)

^b FUJIKURA LTD   (Japan)

Author keywords

Computer cooling; Liquid cooling; Porous structure; Sintered porous heat sink; Thermal control

Indexed keywords

COOLANTS; COOLING; COPPER; DROPS; FORCED CONVECTION; HEAT CONVECTION; HEAT EXCHANGERS; HEAT SINKS; HEAT TRANSFER; MICROPROCESSOR CHIPS; PLATES (STRUCTURAL COMPONENTS); PRESSURE DROP; SINTERING; STRUCTURES (BUILT OBJECTS); TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; THERMOANALYSIS;

COMPUTER COOLING; LIQUID COOLING; POROUS STRUCTURE; SINTERED POROUS HEAT SINK; THERMAL CONTROL;

HEAT RESISTANCE;

EID: 59849095449     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2008.11.016     Document Type: Article

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