Toward the next level of PCB usage in power electronic converters

IEEE Transactions on Power Electronics

Volumn 23, Issue 6, 2008, Pages 3151-3163

  de Jong, Erik C W ^a,b   Ferreira, Braham J A ^a   Bauer, Pavol ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b KEMA   (Netherlands)

Author keywords

Design methodology; Geometrical packaging; Optimization methods; Packaging; Power conversion; Power density; Power supplies; Printed circuit layout; Printed circuits

Indexed keywords

CAMERAS; CONSUMER ELECTRONICS; CONSUMER PRODUCTS; ELECTRIC FUSES; ELECTRIC POWER DISTRIBUTION; ELECTRIC POWER TRANSMISSION NETWORKS; ELECTRIC POWER UTILIZATION; ELECTRONIC EQUIPMENT MANUFACTURE; POWER ELECTRONICS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; TRANSFORMER WINDINGS;

DESIGN METHODOLOGY; GEOMETRICAL PACKAGING; OPTIMIZATION METHODS; PACKAGING; POWER CONVERSION; POWER DENSITY; POWER SUPPLIES; PRINTED CIRCUIT LAYOUT;

PRINTED CIRCUIT BOARDS;

EID: 59749099771     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2008.2004276     Document Type: Article

References (22)

1. Flexible Printed Circuits Open Up a Multitude of Innovative Applications, Freudenberg Mektec Europa GmbH, PCB007, Erkelenz, Germany, Mar. 2004.
2. J. Fjelstad. (2001, Jan.). Flexible circuit origami: The art of packaging IC chips with flexible circuits. CircuiTree Online. Available: http://www.circuitree.com/Articles/Column/ f3faa14b3d7d7010VgnVCM100000f932a8c0.
3. A. Lostetter, F. Barlow, A. Elshabini, K. Olejniczak, and S. Ang, "Polymer thick film (PTF) and flex technologies for low cost power electronics packaging," in Proc. Int. Workshop Integr. Power Packag. (IWIPP), Jul. 2000, vol. 1, pp. 33-40.
4. E. Waffenschmidt and J. Ferreira, "Embedded passives integrated circuits for power converters," in Proc. IEEE Power Electron. Spec. Conf., Jun. 2002, vol. 1, pp. 12-17.
5. W. Brown, A. Malshe, T. Railkar, T. Lenihan, J. Stone, W. Sommers, and L. Schaper, "Thermal management issues and evaluation of a novel, flexible substrate, 3-dimensional (3-D) packaging concept," in Proc. IEEE Int. Conf. Multichip Modules High Density Packag., Denver, CO, Apr. 15-17, 1998, pp. 135-140.
6. E. de Jong, J. Ferreira, and P. Bauer, "Improving the thermal management of AC-DC converters using integration technologies," in Proc. IEEE Ind. Appl. Conf. Oct. 3-7, 2004, vol. 4, pp. 2315-2322.
7. D. Grafham. (1998, Oct. 12). Optimal thermal management of planar magnetics in high frequency SMPS [Online]. Available: www.paytongroup.com
8. S. Ben Yaakov. (2001). The benefits of planar magnetics in HF power conversion [Online]. Available: www.paytongroup.com
9. J. Marinos. (2000, Aug.). Designing planar magnetics [Online]. Available: www.pcim.com
10. P. Zumel, R. Prieto, J. Cobos, and J. Uceda, "Comparative study of flex-foil technology in HF planar transformer windings," in Proc. IEEE Power Electron. Spec. Conf., Jun. 2002, vol. 3, pp. 1248-1253.
11. K. Ngo, R. Alley, and A. Yerman, "Fabrication method for a winding assembly with a large number of planar layers," IEEE Trans. Power Electron., vol. 8, no. 1, pp. 55-61, Jan. 1993.
12. M. Sippola, E. Oyj, and F. Bescherer, "Reel-to-reel manufacturable, lead-less surface mountable, z-folded planar power transformers," in Proc. Int. Conf. Integr. Power Syst., Verband der Elektrotechnik (VDE), Jun. 2006, vol. 1, pp. 255-260.
13. E. Waffenschmidt, B. Ackermann, and J. Ferreira, "Design method and material technologies for passives in printed circuit board embedded circuits," IEEE Trans. Power Electron., vol. 20, no. 3, pp. 576-584, May 2005.
14. J. Ferreira, E. Waffenschmidt, J. Strydom, and J. van Wyk, "Embedded capacitance in the PCB of switchmode converters," in Proc. IEEE Power Electron. Spec. Conf., Jun. 2002, vol. 1, pp. 119-123.
15. E. de Jong, J. Ferreira, and P. Bauer, "LCT integration optimization on a printed circuit board technology platform," in Proc. IEEE Ind. Appl. Conf., Tampa, FL, Oct. 8-12, 2006, vol. 4, pp. 1849-1856.
16. J. Strydom, "Electromagnetic design of integrated resonator-transformers," Ph.D. dissertation, Rand Afrikaans Univ., Johannesburg, South Africa, Dec. 2001.
17. E. de Jong, J. Ferreira, and P. Bauer, "Integrated flex winding realisation for 3D PCB converters," in Proc. IEEE Power Electron. Spec. Conf., Jun. 2006, vol. 1, pp. 2878-2884.
18. E. de Jong, J. Ferreira, and P. Bauer, "Design techniques for thermal management in switch mode converters," IEEE Trans. Ind. Appl., vol. 42, no. 4, pp. 1375-1386, Nov./Dec. 2006.
19. E. de Jong, J. Ferreira, and P. Bauer, "Thermal model extraction as means to thermal management improvement in PCB assembled power converters," in Proc. Power Convers. Intell. Motion (PCIM) Conf., Jun. 2005, vol. 1, pp. 240-245.
20. J. Popović and J. Ferreira, "An approach to deal with packaging in power electronics," IEEE Trans. Power Electron., vol. 20, no. 3, pp. 550-557, May 2005.
21. E. de Jong, J. Ferreira, and P. Bauer, "Evaluating Thermal Management Efficiency in Converters," in Proc. IEEE Power Electron. Spec. Conf. Jun. 20-25, 2004, vol. 6, pp. 4881-4887.
22. J. Popović and J. Ferreira, "Converter concepts to increase the integration level," IEEE Trans. Power Electron., vol. 20, no. 3, pp. 558-565, May 2005.