Effect of substrate temperature on deposition behavior of copper particles on substrate surfaces in the cold spray process

Proceedings of the International Thermal Spray Conference

Volumn , Issue , 2007, Pages 643-650

  Fukumoto, M ^a   Wada, H ^a   Tanabe, K ^a   Yamada, M ^a   Yamaguchi, E ^b   Niwa, A ^b   Sugimoto, M ^b   Izawa, M ^b  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b Shintobrator Ltd   (Japan)

Author keywords

Cold spray; Deposition behavior; Deposition ratio; Gas pressure; Gas temperature; Particle size; Particle velocity; Substrate temperature

Indexed keywords

ALUMINA; COPPER; DEPOSITION; GASES; HEATING; HELIUM; INERT GASES; INORGANIC COATINGS; PARTICLE SIZE; STAINLESS STEEL; SUBSTRATES; THERMAL SPRAYING; VELOCITY CONTROL;

COLD SPRAY; DEPOSITION BEHAVIOR; DEPOSITION RATIO; GAS PRESSURE; GAS TEMPERATURE; PARTICLE VELOCITY; SUBSTRATE TEMPERATURE;

PESTICIDES;

EID: 59349115037     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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