Investigation of strain transmission of surface-bonded FBGs used as strain sensors

Sensors and Actuators, A: Physical

Volumn 149, Issue 2, 2009, Pages 201-207

  Li, W Y ^a   Cheng, C C ^a   Lo, Y L ^b  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Bonding layer; FBG; Finite element method; Strain transmission

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; FIBER BRAGG GRATINGS; POLYIMIDES; POLYMERS; SENSORS; SUBSTRATES;

ACCURATE CORRECTIONS; ANALYTICAL MODELS; BONDING LAYER; CHIP ON FILMS; FBG; LOW-MODULUS; MANUFACTURING INDUSTRIES; NUMERICAL SIMULATIONS; POLY-IMIDE FILMS; SHEAR LAG PARAMETERS; STRAIN DISTRIBUTIONS; STRAIN SENSORS; STRAIN TRANSMISSION; STRUCTURAL STRAINS; SUBSTRATE STRAINS;

FINITE ELEMENT METHOD;

EID: 59249089145     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2008.11.011     Document Type: Article

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