Design of experiments for board-level solder joint reliability of PBGA package under various manufacturing and multiple environmental loading conditions

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 1, 2009, Pages 32-40

  Qi, Haiyu ^a   Osterman, Michael ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Conformal coating; Design of experiment (DOE); Non solder mask defined (NSMD); Plastic ball grid array (PBGA); Solder mask defined (SMD); Temperature cycling; Underfill; Vibration

Indexed keywords

BALL GRID ARRAYS; BRAZING; COATINGS; DENSITY (OPTICAL); DESIGN; DESIGN OF EXPERIMENTS; DIFFRACTIVE OPTICAL ELEMENTS; ELECTROMAGNETIC WAVE EMISSION; ELECTRONICS PACKAGING; EXPERIMENTS; PLASTIC COATINGS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; RELIABILITY ANALYSIS; SOLDERED JOINTS; WELDING;

CONFORMAL COATING; DESIGN OF EXPERIMENT (DOE); NON-SOLDER MASK DEFINED (NSMD); PLASTIC BALL GRID ARRAY (PBGA); SOLDER MASK DEFINED (SMD); TEMPERATURE CYCLING; UNDERFILL; VIBRATION;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 59149094182     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.2005905     Document Type: Article

References (19)

1. E. J. Vardaman, R. Crowley, and T. Goodman, "The market for ball grid array packages," in Proc. 1995 Japan Int. Electron. Manuf. Technol. Symp., 1995 Japan IEMT Symp., New York, 1996, pp. 205-207.
2. W. D. Bjorndahl, K. Selk, and W. Chen, "Surface mount technology -Capabilities and requirements," in Proc. 1997 IEEE Aerospace Conf. New York, 1997, vol. 4, pp. 285-291.
3. R. Guha, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, M. Osterman, H. Qi, J. Kennedy, and J. Veum, "Plastic ball-grid-arrays (PBGA): Are they ready for environmentally harsh aerospace applications?," in Proc. 02WAC-149, World Aviation Congr. Display (WAC), Phoenix, AZ, Nov. 2002, pp. 1-5.
4. T. Baumann, T. Burnette, D. Humphrey, J. Kennedy, T. Koschmieder, M. Osterman, H. Qi, K. Prodromides, and J. Veum, "Underfilled PBGA packages and their board level cycling and vibration performance," in Proc. SMTA Int. 2002, Rosemont, IL, Sep. 2002, pp. 1-5.
5. T. Burnette, Z. Johnson, T. Koschmieder, and W. Oyler, "Underfilled BGAs for a variety of plastic BGA package types and the impact on board-level reliability," in Proc. 51st Electron. Compon. Technol. Conf., Orlando, FL, May 29-Jun. 1 2001, pp. 1045-1051, 2001.
6. R. Rorgren, P.-E. Tegehall, and P. Carlsson, "Test methods and reliability evaluation of BGA packages for automotive electronics," in Proc. 34th ISHM-Nordic Annu. Conf., Molndal, Sweden, 1997, pp. 179-185, ISHM-Nordic, 186/1-2.
7. Z. Johnson and T. Koschmieder, "BGA underfills," Adv. Packag., vol. 10, no. 12, pp. 29-33, Dec. 2001.
8. S. Cho and B. Han, "Effect of underfill on flip-chip solder bumps: An experimental study by microscopic moire interferometry," Int. J. Microcircuits Electron. Packag., vol. 24, no. 3, pp. 217-239, 2002.
9. J. H. Okura, S. Shetty, B. Ramakrishnan, and A. Dasgupta, "Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies," Microelectron. Rel. vol. 40, no. 7, pp. 1173-1180, Jul. 2000.
10. K. Darbha, J. H. Okura, and A. Dasgupta, "Impact of underfill filler particles on reliability of flip chip interconnects," IEEE Trans. Compon., Packag., Manuf. Technol. A, vol. 21, no. 2, pp. 275-280, Jun. 1998.
11. Y. Hang, D. Bigio, and M. Pecht, "Fill pattern and particle distribution of underfill material," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 3, pp. 493-498, Sep. 2004.
12. K. Zhang and M. Pecht, "Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity high temperature tests," Microelectron. Int., vol. 17/3, pp. 16-20, 2000.
13. Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies, NASA Technical Standard, NASA-STD-8739.1, Aug. 6, 1999 [Online]. Available: http:// www.hq.nasa.gov/office/codeq/doctree/87391.pdf, (Oct. 11, 2005).
14. J. Sprovieri, "The thin polymer line," Assembly Mag., Jan. 1, 2003 [Online]. Available: http://www.assemblymag.com/Articles/ Feature_Article/6aef390b7d5c9010VgnVCM100000f932a8c0, (Jul. 11, 2008)
15. Motorola Part # DSYCHN-272PBGA.
16. "Guidelines for accelerated reliability testing of surface mount attachments," Inst. of Interconnecting and Packaging Electronic Circuits, Northbrook, IL, Nov. 1992, IPC-SM-785.
17. "Pareto chart of the effects," Minitab Help, Minitab Release 14, 2005.
18. R. V. Lenth, "Quick and easy analysis of unreplicated factorials," Technometrics, 31, pp. 469-473, 1989.
19. H. Qi, M. Lee, M. Osterman, K. Lee, S. Oh, and T. Schmidt, "Simulation model development for solder joint reliability for high performance FBGA assemblies," in Proc. 20th Semicond. Thermal Meas. Manag. Symp., San Jose, CA, Mar. 9-11, 2004, pp. 300-307.