Effect of temperature on the dynamic mechanical properties of resin film and wood

Forest Products Journal

Volumn 58, Issue 12, 2008, Pages 68-74

  Peng, Yucheng ^a   Shi, Sheldon Q ^a   Kim, Moon G ^a  

^a MISSISSIPPI STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DOUGLAS FIRS; DYNAMIC MECHANICAL PROPERTIES; DYNAMIC MECHANICALS; DYNAMIC PERFORMANCE; EFFECT OF TEMPERATURES; FIXED FREQUENCIES; HEAT RESISTANTS; ISOTHERMAL TESTING; ISOTHERMAL TESTS; LOSS MODULUS; PHENOL RESORCINOL FORMALDEHYDES; PSEUDOTSUGA MENZIESII; SHEAR STORAGE MODULUS; STORAGE MODULUS; STRUCTURAL ADHESIVES; TEMPERATURE LEVELS; TEMPERATURE RANGES; TEMPERATURE SCANS; WOOD SAMPLES;

CURING; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; DYNAMICS; ELASTIC MODULI; FILM PREPARATION; MECHANICAL PROPERTIES; MECHANISMS; PHENOLS; RESINS; TANNING; WOOD PRODUCTS;

WOOD;

ADHESIVES; DYNAMICS; ELASTIC STRENGTH; HEAT TREATMENT; MECHANICAL PROPERTIES; PHENOLS; TANNING; WOOD PRODUCTS; WOOD RESIN;

PINUS ECHINATA; PINUS PALUSTRIS; PSEUDOTSUGA; PSEUDOTSUGA MENZIESII;

EID: 59049102382     PISSN: 00157473     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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