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Volumn 47, Issue 9-10, 2008, Pages 531-537
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Processing and characterization of CNT/Cu nanocomposites by powder technology
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Author keywords
Carbon nanotube; Electrical resistivit; Electroless copper deposition; Sintering
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Indexed keywords
CARBON NANOTUBE;
CITRATE BATHS;
COMPACTION PRESSURES;
COPPER MATRIX;
COPPER PARTICLES;
COPPER SAMPLES;
CU DEPOSITION;
ELECTRICAL RESISTIVIT;
ELECTROLESS;
ELECTROLESS COPPER DEPOSITION;
ELEMENTAL ANALYSIS (EA);
NANOCOMPOSITE POWDERS;
POWDER TECHNOLOGY;
PROBE METHODS;
SPARK PLASMAS;
TORR VACUUM;
X-RAY DIFFRACTION (XRD) PATTERNS;
AGGLOMERATION;
CARBON NANOTUBES;
COPPER;
COPPER PLATING;
COPPER POWDER;
COPPER POWDER METALLURGY;
ELECTRIC RESISTANCE;
ELECTRODEPOSITION;
LITHIUM COMPOUNDS;
NANOCOMPOSITES;
NANOTUBES;
OXYGEN;
POWDERS;
SINTERING;
SULFUR;
TITRATION;
X RAY ANALYSIS;
X RAY DIFFRACTION ANALYSIS;
METALLIC MATRIX COMPOSITES;
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EID: 58549109872
PISSN: 10681302
EISSN: 15739066
Source Type: Journal
DOI: 10.1007/s11106-008-9055-x Document Type: Article |
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Times cited : (41)
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References (11)
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