Pulse magnetoelectrolysis

Electrochemistry Communications

Volumn 11, Issue 2, 2009, Pages 318-322

  Yang, Xuegeng ^a,b   Eckert, Kerstin ^b   Mühlenhoff, Sascha ^b   Uhlemann, Margitta ^a   Odenbach, Stefan ^b  

^a IFW DRESDEN   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Copper electrolysis; Current modulation; Magnetoelectrolysis; MHD flow; Pulse Plating

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTROLYSIS; ELECTROMAGNETIC FIELD EFFECTS; ELECTROPLATING; FLOW VISUALIZATION; LORENTZ FORCE; MAGNETIC FIELD EFFECTS; MAGNETIC FIELDS;

COPPER ELECTROLYSIS; CURRENT MODULATION; MAGNETOELECTROLYSIS; MHD FLOW; PULSE PLATING;

MODULATION;

EID: 58549085566     PISSN: 13882481     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.elecom.2008.11.053     Document Type: Article

References (12)

1. Ibl N. Surf. Technol. 10 (1980) 81
2. Hinds G., Coey J.M.D., and Lyons M.E.G. Electrochem. Commun. 3 (2001) 215
3. Hinds G., Spada F.E., Coey J.M.D., Mhiochain T.R.N., and Lyons M.E.G. J. Phys. Chem. B 105 (2001) 9487
4. Aaboubi O., Chopart J.P., Douglade J., Olivier A., Gabrielli C., and Tribollet B. J. Electrochem. Soc. 137 (1990) 1796
5. O'Reilly C., Hinds G., and Coey J.M.D. J. Electrochem. Soc. 148 (2001) C674
6. Devos O., Aaboubi O., Chopart J.P., and Olivier A. J. Phys. Chem. A 104 (2000) 1544
7. Uhlemann M., Krause A., Chopart J.P., and Gebert A. J. Electrochem. Soc. 152 (2005) C817
8. Krause A., Uhlemann M., Gebert A., and Schultz L. J. Solid State Electrochem. 11 (2007) 679
9. Krause A., Uhlemann M., Gebert A., and Schultz L. Thin Solid Films 515 (2006) 1694
10. Koza J., Uhlemann M., Gebert A., and Schultz L. J. Solid State Electrochem. 12 (2008) 181
11. Yang X., Eckert K., Heinze A., and Uhlemann M. J. Electroanal. Chem. 613 (2008) 97
12. Yang X., Eckert K., Seidel K., and Uhlemann M. Electrochim. Acta 54 (2008) 352