Influence of silicon carbide filler on mechanical and dielectric properties of glass fabric reinforced epoxy composites

Journal of Applied Polymer Science

Volumn 111, Issue 2, 2009, Pages 685-691

  Suresha, B ^a   Chandramohan, G ^b   Renukappa, N M ^c   Siddaramaiah, ^c  

^a NATIONAL INSTITUTE OF ENGINEERING   (India)

^b PSG COLLEGE OF TECHNOLOGY   (India)

^c SRI JAYACHAMARAJENDRA COLLEGE OF ENGINEERING   (India)

Author keywords

Electrical properties; Failure mechanisms; Glass fabric reinforced epoxy composite; Mechanical properties; SiC filler

Indexed keywords

BENDING STRENGTH; CARBON FIBER REINFORCED PLASTICS; CERAMIC CAPACITORS; DIELECTRIC LOSSES; DIELECTRIC PROPERTIES; DIELECTRIC PROPERTIES OF SOLIDS; DIELECTRIC WAVEGUIDES; ELECTRIC PROPERTIES; FABRICS; FAILURE ANALYSIS; FILLERS; GLASS; HARDNESS; MECHANICAL PROPERTIES; MECHANISMS; PERMITTIVITY; POLYMER MATRIX COMPOSITES; POLYMERIC GLASS; SAFETY ENGINEERING; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; STRENGTH OF MATERIALS; TENSILE STRENGTH;

AC CONDUCTIVITY; ASTM STANDARDS; COMPOSITE SYSTEMS; DESIGN FLEXIBILITY; DIELECTRIC CONSTANTS; ELECTRICAL PROPERTIES; ENGINEERING APPLICATIONS; FAILURE MECHANISMS; FIBER REINFORCED POLYMERIC (FRP) COMPOSITES; GLASS FABRIC REINFORCED EPOXY COMPOSITE; LIGHT WEIGHTING; MECHANICAL PERFORMANCES; SIC FILLER;

EPOXY RESINS;

BREAKING ELONGATION; DIELECTRIC PROPERTY; EPOXY RESIN; FABRICATION; FIBER REINFORCED COMPOSITE; FILLING MATERIAL; FLEXIBILITY; GLASS FIBER FABRIC; POLYMER; REINFORCED FABRIC; SCANNING ELECTRON MICROSCOPY; SILICON; TENSILE PROPERTY;

EID: 58449089845     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.29116     Document Type: Article

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