Defect performance for PVD of TiW and TiWN films

Solid State Technology

Volumn 40, Issue 11, 1997, Pages 109-116

  Cheney, Eric ^a   Lazaroff, Dennis ^a   Morales, Diana ^b,c   Yap, Lip ^b,c   Chiu, Leon ^b  

^a HEWLETT PACKARD COMPANY   (United States)

^b Johnson Matthey Electronics   (United States)

^c NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844412916     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (9)

1. J. Turn, D. Marx, "The Role of W-Ti Target Density on Particulate Generation," European Semiconductor, Vol. 17, No. 5, p. 27, May 1995.
2. V. Hoffman, "Tungsten Titanium Diffusion Barrier Metallization," Solid State Technology, Vol. 26, No. 6, pp. 119-126, June 1983.
3. D. Pramanik, V. Jain, "Barrier Metals for ULSI: Deposition and Manufacturing," Solid StateTechnology, Vol. 36, No. 1, p. 73, January 1993.
4. C.B. Yeap, H.M. Li, E.Z. Liu, H.L. Chew, "TiW Particle Control for VLSI Manufacturing," Proceedings of the SPIE - The International Society for Optical Engineering, Vol. 2635, p. 30, 1995.
5. J. Dunlop, E. Waterman, T. Brat, "Effects of Ti-W Target Processing Methods on Defect Generation during VLSI Device Fabrication," Proceedings of the American Vacuum Society 37th Annual Symposium and Topical Conferences, Toronto, CA, October 8-12, 1990.
6. C. Wickersham, J. Poole, J. Muller, "Particle Emission from W-10Ti Sputtering Targets," Proceedings of VMIC 1991, p. 82, 1991.
7. J. Dunlop, H Rensing, U.S. Patent #4,838,935.
8. C. Lo, "Effect of Microstructure on Mechanical Properties in Tungsten-Titanium," Proceedings of the 1995 3rd. International Conference on Tungsten and Refractory Metals, McLean, VA, pp. 169-181, 1995.
9. M. Hill, "Magnetron Sputtered Titanium-Tungsten Films," Solid State Technology, Vol. 23, No. 1, pp. 53-59, January 1980.