Implementation of disturbance function to determine thermal fatigue life of solder joints in QFP packages

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1479-1485

  Chia, John ^a   Chia, Hans ^b  

^a SINOTECH ENGINEERING CONSULTANTS INC   (Taiwan)

^b GENERAL ELECTRIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844397068     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (27)

1. Busso E.P., Kitano, M, and Kumazawa, T., 1994, "Modeling Complex Inelastic Deormation Processes in IC Packages's Solder Joints," ASME Journal of Electronic Packaging, Vol. 116(1), pp. 6-15.
2. Chia, J., Desai, C.S., Kundu, T., and Prince, J.L., 1993, "Unified Constitutive Modelling of Interfaces and Materials in semiconductor Devices," Proceeding of ASME Winter Annual Meeting, New Orleans, LA, pp. 113-125.
3. Chia, J., 1994, "Constitutive Modeling of Thermomechanical Response of Materials in Semiconductor devices with emphasis on Interface Behavior," Ph.D. Dissertation, The University of Arizona, Tucson, Arizona.
4. Desai, C.S., Chia, J., Kundu, T., and Prince, J.L., 1996, "Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I-Unified Constitutive Models; Part II-Validation and Design," ASME Journal of Electronic Packaging (in press).
5. Desai, C.S., 1992, "The Disturbed State as a Phase Transformation through Self Adjustment Concept for Modeling of Mechanical Response of Materials and Interfaces," Report, Dept. of Civil Eng. and Eng. Mechs., Univ. of Arizona, Tucson, AZ.
6. Fantziskonis, G. and Desai, C.S., 1987, "Constitutive Model with Strain Softening," Int. Journal. Solids Structures, 23, 6, pp. 751-767.
7. Govila, R.K. et al., 1994, "Failure Analysis of No-Clean and Water-Clean Solder Joint 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack," ASME Journal of Electronic Packaging, Vol. 116(3), pp. 184-190.
8. Guo, Z., Sprecher, A.F., and Conard, H., 1992, "Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue," ASME Journal of Electronic Packaging, Vol. 114(2), pp. 112-117.
9. Jain P., 1995, "296 Lead Fine Pitch (0.4 mm) Thin Plastic QFP Package with TAB Interconnect," IEEE transactions on Components, Hybrids, and Manufacturing Technology, Vol. 18(3), pp. 463-470.
10. Kachanov, L.M., 1986, "Introduction to Continuum Damage Mechanics," Martinus Nijhoft Publishers, Dordrecht, The Netherlands.
11. Lau, J., 1990, "Thermal Fatigue Life of 256-Pin, 0.4 mm Pitch Plastic Quad Flat Pack (QFP) Solder Joints," Proceedings. 1st ASME/JSME Electronic Packaging Conference, pp. 855-863.
12. Lau, J. et al., 1992, "Solder Joint Reliability of a Thin Small Outline Package (TSOP)," Proceedings 42nd Electronic Components and Technology Conf., pp. 519-532.
13. Lau, J., 1991, "Solder Joint Reliability: Theory and Applications," Van Nostrand Reinhold, NY.
14. Marshall, J.L., Foster, L.A., and Sees, J.A., 1994, "Interfaces and Intermetallics," Frear, P., Morgan, H., Burchett, S., and Lau, J., Eds., The mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, NY, pp. 42-86.
15. Morgan, H.S., 1994, "Thermomechanical Modeling of Solder Joints-Numerical Considerations,", Frear, P., Morgan, H., Burchett S., and Lau J., Eds., The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, NY, pp. 314-335.
16. Pan, T., 1991, "Thermal Cycling Induced Plastic Deformation in Solder Joints, Part I: Accumulated Deformation in Surface Mount Joints," ASME Journal of Electronic Packaging, Vol. 113(1), pp. 8-15.
17. Pan, T., 1994, "Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints," ASME Journal of Electronic Packaging, Vol. 116(3), pp. 163-170.
18. Paydar, N, Tong, Y., and Akay, H.U., 1994, "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints," ASME Journal of Electronic Packaging, Vol. 116(4), pp. 265-273.
19. Perzyna, P., 1966, "Fundamental Problems in Viscoplasticity, "Advances in Applied Mechanics, Academic Press, NY., 9, pp. 244-368.
20. Sauber J. and Seyyedi J., 1992, "Predicting Thermal Fatigue Lifetimes for SMT Solder Joints," ASME Journal of Electronic Packaging, Vol. 114(4), pp. 472-475.
21. Solomon, H.D., 1985, "Low-Frequency, High Temperature, Low Cycle Fatigue of 60Sn/40Pb Solder," in Low Cycle Fatigue, STM-STP 942, eds by Solomon H.D. et al., ASTM, pp. 342-371.
22. Solomon, H.D., 1989, "Strain-Life Behavior in 60/40 Solder," ASME Journal of Electronic Packaging, Vol. 111(2), pp. 75-82.
23. Solomon, H.D., 1991, "Predicting Thermal and mechanical Fatigue Lives from Isothermal Low Cycle Data," Ed. by Lau, J.H., Van Nostrand Reinhold, NY, pp. 406-454.
24. Solomon, H.D., 1992, "Isothermal Fatigue of LCC/PWB Interconnections," ASME Journal of Electronic Packaging, Vol. 114(2), pp. 161-168.
25. Subrahmanyan, R., Wilcox, J.R., and Li, C.Y., 1989, "A Damage Integral Approach to Thermal Fatigue of Solder Joints," IEEE transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12(4), pp. 480-491.
26. Totani, M. et al., 1995, "Design of 0.35-mm Pitch QFP Lead and Its Assembly Technology," IEEE transactions on Components, Hybrids, and Manufacturing Technology, Vol. 18(3), pp. 456-462.
27. Zubelewicz, A. et al., 1990, "Micromechanical Method to Predict Fatigue Life of Solder," ASME Journal of Electronic Packaging, Vol. 112(3), pp. 179-182.