Etch rate and plasma density radial uniformity measurements in a cusped field helicon plasma etcher

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 14, Issue 3, 1996, Pages 1041-1045

  Quick, A K ^a   Chen, R T S ^a   Hershkowitz, N ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844396869     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.580130     Document Type: Article

References (7)

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4. G. A. Campbell et al., Proc. SPIE 1803, 226 (1992).
5. R. T. S. Chen, R. A. Breun, S. Gross, N. Hershkowitz, M.-K. J. Hsieh, and J. Jacobs, Plasma Sources Sci. Technol. 4, 337 (1995).
6. N. Hershkowitz, Discharge Parameters and Chemistry, 1st ed., Plasma Diagnostics Vol. 1 (Academic, Boston, 1986).
7. J. Ding, J.-S. Jeng, G.-H. Kim, H. L. Maynard, J. S. Hamers, N. Hershkowitz, and J. W. Taylor, J. Vac. Sci. Technol. A 11, 1283 (1993).