Dual sensor technology for high-speed detection of 0.1 micron defects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 1926, Issue , 1993, Pages 570-581

  Alumot, David ^a   Neumann, Gadi ^a   Sherman, Rivi ^a   Tirosh, Ehud ^a  

^a Orbot Instruments Ltd   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844288530     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.148996     Document Type: Conference Paper

References (8)

1. M. M. Slama, M. Bennet-Lilly and P. W. Fletcher, "Advanced in-line process control of defects", proc. SPIE vol. 1673. pp. 496-505 (1992).
2. G. Dickerson, R. Wallace, "In-line wafer inspection using 100 megapixel per second digital image processing technology", proc. SPIE vol. 1464 pp. 584-595 (1991).
3. R. Browning, I. Lincoln, P. Stonestorm, "Recent advances in es automated patterned wafer inspection", proc. SPIE vol. 1087, pp. 440-444 (1989).
4. S. P. Billat, "Automated defect detection on patterned wafers", Semiconductor International (May 1987).
5. M. A. Tubenblatt and J. S. Batchelder, "Patterned wafer inspection using spatial filtering for cluster environment", App. Opt. vol. 31 pp. 3354-3362 (1992).
6. Y. Miyazaki, H. Tanaka, N. Kopsaka, T. Tomoda, "Surface defect inspection system with an optical spatial frequency filter for semiconductor patterned wafers", proc. SPIE vol. 1673 pp. 515-525 (1992).
7. V. Brecher and B. E. Dom "Recent advances in inspecting integrated circuits for pattern defects", IBM report RC17653 (1992)
8. R. Sherman, E. Tirosh and Z. Smilansky, "An automatic defect classification system for semiconductor wafers", proc. SPIE vol. 1907 (1993)