SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 227-230

Specific heat capacities of Sn-Zn-based solders and Sn-Ag-Cu solders measured using differential scanning calorimetry

(3) Wu, Y K a Lin, K L a Salam, B a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Differential scanning calorimetry; Lead free solder; Sn Ag Cu; Sn Zn; Specific heat capacity

Indexed keywords

AMERICAN SOCIETY FOR TESTING AND MATERIALS; HEATING TEMPERATURES; LEAD-FREE SOLDER; SILVER CONTENTS; SN-37PB; SN-AG-CU; SN-ZN; SOLDER ALLOYS; SPECIFIC HEAT CAPACITY; STANDARD TEST METHODS;

BRAZING; CALORIMETERS; CALORIMETRY; COPPER; DIFFERENTIAL SCANNING CALORIMETRY; FLUXES; GALLIUM; LASER INTERFEROMETRY; LEAD; MATERIALS TESTING; METALLIC COMPOUNDS; SCANNING; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SPECIFIC HEAT; TIN ALLOYS; WELDING; ZINC;

TIN;

EID: 58349116008 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0589-y Document Type: Article

Times cited : (36)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.