메뉴 건너뛰기




Volumn , Issue , 2007, Pages 50-57

Uncertainty assessment of prognostics of electronics subject to random vibration

Author keywords

[No Author keywords available]

Indexed keywords

ACCUMULATED DAMAGES; CASE STUDIES; CONFIDENCE INTERVALS; DOMINANT INPUTS; ELECTRONIC CIRCUIT BOARDS; FAILURE CRITERIONS; FAILURE TIMES; INPUT PARAMETERS; MEASUREMENT UNCERTAINTIES; MODEL OUTPUTS; MONTE CARLO SIMULATIONS; PARAMETER UNCERTAINTIES; PROGNOSTIC ANALYSES; RANDOM VIBRATIONS; REMAINING LIVES; UNCERTAINTY ASSESSMENTS; UNCERTAINTY SOURCES;

EID: 58349098139     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (40)

References (16)
  • 5
    • 58349103437 scopus 로고    scopus 로고
    • Gu, J, Barker, D., and Pecht, M. Prognostics Implementation of Electronics Under Vibration Loading. Accepted by the Journal of Microelectronic Reliability.
    • Gu, J, Barker, D., and Pecht, M. Prognostics Implementation of Electronics Under Vibration Loading. Accepted by the Journal of Microelectronic Reliability.
  • 7
    • 34548716433 scopus 로고    scopus 로고
    • Methods for Binning and Density Estimation of Load Parameters for Prognostics and Health Management
    • Vichare, N., Rodgers, P., and Pecht, M. 2006. Methods for Binning and Density Estimation of Load Parameters for Prognostics and Health Management. International Journal of Performability Engineering 2(2): 149-161.
    • (2006) International Journal of Performability Engineering , vol.2 , Issue.2 , pp. 149-161
    • Vichare, N.1    Rodgers, P.2    Pecht, M.3
  • 8
    • 84950426173 scopus 로고
    • Recent Developments in Non Parametric Density Estimation
    • Izenman, A.J. 1991. Recent Developments in Non Parametric Density Estimation. Journal of American Statistical Association 86(413): 205-213.
    • (1991) Journal of American Statistical Association , vol.86 , Issue.413 , pp. 205-213
    • Izenman, A.J.1
  • 9
    • 58349107196 scopus 로고    scopus 로고
    • Vishay Technical Articles, 2005, Quality Control of Strain Gauge Installations, Vishay Inc.
    • Vishay Technical Articles, 2005, Quality Control of Strain Gauge Installations, Vishay Inc.
  • 10
    • 58349110041 scopus 로고    scopus 로고
    • Vishay Technique Note, 2005, Errors Due to Wheatstone Bridge Nonlinearity, TN-507-1, Vishay Inc.
    • Vishay Technique Note, 2005, Errors Due to Wheatstone Bridge Nonlinearity, TN-507-1, Vishay Inc.
  • 11
    • 58349105133 scopus 로고    scopus 로고
    • Vishay Technique Note, 2005, Errors Due to Misalignment of Strain Gages, TN-511, Vishay Inc.
    • Vishay Technique Note, 2005, Errors Due to Misalignment of Strain Gages, TN-511, Vishay Inc.
  • 12
    • 58349085472 scopus 로고    scopus 로고
    • Vishay Technique Note, 2005, Strain Gage Selection -Criteria, Procedures, Recommendations, TN-505-4, Vishay Inc.
    • Vishay Technique Note, 2005, Strain Gage Selection -Criteria, Procedures, Recommendations, TN-505-4, Vishay Inc.
  • 14
    • 58349117608 scopus 로고    scopus 로고
    • Mil-Std-810 Section 514.4: Accelerated Testing.
    • Mil-Std-810 Section 514.4: Accelerated Testing.
  • 15
    • 1542335788 scopus 로고    scopus 로고
    • Global Trends in Lead-free Soldering, Part II
    • Lau, J.H., and Liu, K. 2004. Global Trends in Lead-free Soldering, Part II. Advanced Packaging 13(2): 25-28.
    • (2004) Advanced Packaging , vol.13 , Issue.2 , pp. 25-28
    • Lau, J.H.1    Liu, K.2
  • 16
    • 30844437500 scopus 로고    scopus 로고
    • Vibration Fatigue Reliability of BGA-IC Package with Pb-free Solder and Pb-Sn Solder
    • Kim, Y.B, Noguchi, H., and Amagai, M. 2006. Vibration Fatigue Reliability of BGA-IC Package with Pb-free Solder and Pb-Sn Solder. Journal of Microelectronics Reliability 46: 459-466.
    • (2006) Journal of Microelectronics Reliability , vol.46 , pp. 459-466
    • Kim, Y.B.1    Noguchi, H.2    Amagai, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.