Thermal impact and process diagnosis of copper chemical mechanical Polish

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 83-85

  Chiou, Hung Wen ^a   Lin, Zong Huei ^a   Kuo, Liang Hsuan ^a   Shih, Shing Yih ^a   Chen, Lai Juh ^a   Hsia, Chin ^a  

^a Submicron Technology Group   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; INTEGRATED CIRCUIT INTERCONNECTS;

COPPER DAMASCENE; INFRARED THERMAL-CAMERA; MICRO AND MACRO; MICRON TECHNOLOGIES; NON-UNIFORMITIES; PROCESS DIAGNOSIS; THERMAL IMPACTS; TRENCH STRUCTURES;

COPPER;

EID: 58249134144     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787085     Document Type: Conference Paper

References (8)

1. S.V. Babu and et al., "Some Fundamental and Technological Aspects of Chemical Mechanical Polishing of Copper films: A Brief Review", Feb., p385 CMP-MIC Conference. 1998.
2. T. Park and et al., "Pattern and Process Dependencies in Copper Damascene Mhemical Mechanical Polishing Processes", Jun., p437 VM1C Conference, 1998.
3. th edition, p217, 1998.
4. O. Wu and et al., "Mechanism of Copper Damascene CMP", p150. Feb., CMP-MIC Conference. 1998.
5. Z. Stavreva and et al. "Characteristics in Chemical-mechanical Polishing of Copper Comparison of Polishing Pads". p39. 108. Applied Surface Science, 1998.
6. Q. Luo and et al., "Mechanism of Copper Removal During Chemical Mechanical Polishing in Alkaline Media", p287, Feb., CMP-MIC Conference, 1997.
7. S.V. Babu and et al., "Investigation of Cu and Ta Polishing Using Hydrogen Peroxide, Glycine and a Catalvst", p443. Jun., VMIC - Conference. 1998.
8. H.W. Chiou and et al., "On Monitoring CMP Removal Rate by In-Situ Temperature Measurements". p131, Feb., CMP-MIC, 1997.