High-temperature thermoelectric properties of Nb-doped MNiSn (M = Ti, Zr) half-Heusler compound

Journal of Alloys and Compounds

Volumn 469, Issue 1-2, 2009, Pages 50-55

  Muta, Hiroaki ^a   Kanemitsu, Takanori ^a   Kurosaki, Ken ^a   Yamanaka, Shinsuke ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Electrical transport; Heat conduction; Thermoelectric material

Indexed keywords

CARRIER MOBILITY; CIVIL AVIATION; DIFFUSION; DOPING (ADDITIVES); ELECTRIC CONDUCTIVITY; ELECTRIC POWER FACTOR; ENERGY GAP; GALLIUM ALLOYS; GALVANOMAGNETIC EFFECTS; HALL EFFECT; HALL MOBILITY; HEAT CONDUCTION; NIOBIUM; NIOBIUM COMPOUNDS; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRIC EQUIPMENT; ZIRCONIUM;

AMBIPOLAR DIFFUSIONS; BAND GAPS; CARRIER EFFECTIVE MASSES; ELECTRICAL CONDUCTIVITIES; ELECTRICAL TRANSPORT; HALL COEFFICIENTS; HEUSLER COMPOUNDS; HIGH TEMPERATURES; HOLE CONDUCTIVITIES; POWER FACTORS; ROOM TEMPERATURES; TEMPERATURE DEPENDENCES; THERMOELECTRIC MATERIAL; THERMOELECTRIC PROPERTIES;

MAGNETIC FIELD EFFECTS;

EID: 58249126153     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.02.041     Document Type: Article

References (22)

1. Okuda T., Nakanishi K., Miyasaka S., and Tokura Y. Phys. Rev. B 63 (2001) 113104
2. Obara H., Yamamoto A., Lee C., Kobayashi K., Matsumoto A., and Funahashi R. Jpn. J. Appl. Phys. Part 2 43 (2004) L540
3. Ohta S., Nomura T., Ohta H., Hirano M., Hosono H., and Koumoto K. Appl. Phys. Lett. 87 (2005) 092108
4. Muta H., Ieda A., Kurosaki K., and Yamanaka S. Mater. Trans. 46 (2005) 1466
5. Aliev F.G., Kozyrkov V.V., Moshchalkov V.V., Scolozdra R.V., and Durczewski K. Z. Phys. B 80 (1990) 353
6. Uher C., Yang J., and Hu S. Phys. Rev. B 59 (1999) 8615
7. Shen Q., Chen L., Goto T., Hirai T., Yang J., Meisner G.P., and Uher C. Appl. Phys. Lett. 79 (2001) 4165
8. Bhattacharya S., and Tritt T.M. Appl. Phys. Lett. 81 (2002) 43
9. Sakurada S., and Shutoh N. Appl. Phys. Lett. 86 (2005) 082105
10. Muta H., Kanemitsu T., Kurosaki K., and Yamanaka S. Mater. Trans. 47 (2006) 1453
11. Culp S.R., Poon S.J., Hickman N., Tritt T.M., and Blumm J. Appl. Phys. Lett. 88 (2006) 042106
12. Arushanov E., Kaefer W., Fess K., Kloc C., Friemelt K., and Bucher E. Physica Status Solidi A 177 (2000) 511
13. Sekimoto T., Kurosaki K., Muta H., and Yamanaka S. J. Alloys Compound 407 (2006) 326
14. Zhou M., Chen L., Feng C., Wang D., and Li J. J. Appl. Phys. 101 (2007) 113714
15. Kimura Y., and Zama A. Appl. Phys. Lett. 89 (2006) 172110
16. Sekimoto T., Kurosaki K., Muta H., and Yamanaka S. Appl. Phys. Lett. 89 (2006) 092108
17. Mott N.F., and Jones H.A. The Theory of the Properties of Metals and Alloys (1936), Clarendon, Oxford
18. Tobola J., and Pierre J. J. Alloys Compound 296 (2000) 243
19. In: Rowe D.M. (Ed). CRC Handbook of Thermoelectrics (1995), CRC Press
20. Chaput L., Tobola J., Pecheur P., and Scherrer H. Phys. Rev. B 73 (2006) 045121
21. Jonker G.H. Phillips Res. Rep. 23 (1968) 131
22. Seeger K. Semiconductor Physics. 5th ed. (1991), Springer-Verlag