Deposition of TiO2 nanoparticles in surfactant-containing aqueous suspension by a pulsed DC charging-mode electrophoresis

Journal of the Ceramic Society of Japan

Volumn 117, Issue 1361, 2009, Pages 127-132

  Naim, M Nazli ^a   Kuwata, Masahiko ^b   Kamiya, Hidehiro ^a   Lenggoro, I Wuled ^a  

^a TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

^b SOKA UNIVERSITY   (Japan)

Author keywords

Charging; Direct current; Dispersant; Electrophoretic deposition; Osmosis; Pulse; Titanium dioxide

Indexed keywords

CHARGING (FURNACE); DEPOSITION; ELECTROPHORESIS; METAL NANOPARTICLES; MIXING; NANOPARTICLES; OSMOSIS; PARTICLE SIZE; PARTICLE SIZE ANALYSIS; STAINLESS STEEL; SURFACE ACTIVE AGENTS; TITANIUM DIOXIDE;

AQUEOUS SUSPENSIONS; DEPOSITION PROCESS; DIRECT CURRENT; DISPERSANTS; ELECTROPHORETIC DEPOSITIONS; ORGANIC SURFACTANTS; PULSE; STAINLESS STEEL ELECTRODE;

SUSPENSIONS (FLUIDS);

EID: 58149522007     PISSN: 18820743     EISSN: 13486535     Source Type: Journal    
DOI: 10.2109/jcersj2.117.127     Document Type: Article

References (23)

1. Y. Ohko, K. Hashimoto and A. Fujishima, J. Phys. Chem. A, 101, 8057-8062 (1997).
2. S. Yanagida, A. Nakajima, Y. Kameshima, N. Yoshida, T. Watanabe and K. Okada, Mater. Res. Bull, 40, 1335-1344 (2003).
3. G. X. Shen, Y. C. Chen, L. Lin, C. J. Lin and D. Scantlebury, Electrochim. Acta, 50, 5083-5089 (2005).
4. K. R. Patil, S. D. Sathaye, Y. B. Khollam, S. B. Deshpande, N. R. Pawaskar and A. B. Mandale, Mater. Lett., 57, 1775-1780 (2003).
5. A. Z. Simoes, M. A. Zaghete, M. Cilense, J. A. Varela and B. D. Stojanovic, J. Eur. Ceram. Soc., 21, 1151-1157 (2001).
6. L. Besra and M. Liu, Prog. Mater. Sci., 52, 1-61 (2007).
7. C. Kaya, F. Kaya, B. Su, B. Thomas and A. R. Boccaccini, Surf. Coatings Technol., 191, 303-310 (2005).
8. T. Uchikoshi, K. Ozawa, B. D. Hatton and Y. Sakka, J. Mater. Res., 16[2], 321-324 (2001).
9. K. Saber, C. C. Koch and P. S. Fedkiw, Mater. Sci. Eng. A, 341, 174-181 (2003).
10. X. Pang and I. Zhitomirsky, Mater. Character., 58, 339-348 (2007).
11. I. Zhitomirsky and A. Petric, Mater. Sci. & Eng. B, 781, 1254-1301 (2000).
12. A. V. Delgado, F. Gonzalez-Caballero, R. J. Hunter, L. K. Koopal and J. Lyklema, J. Coll. Int. Sci., 309, 194-224 (2007).
13. P. Gyftou, M. Stoumbouli, E. A. Pavlatou and N. Spyrellis, Trans. of the Insti. Metal Finish., 80[3], 88 (2002).
14. A. F. Zimmerman, D. G. Clark and K. T. Aust, U. Erb. Mater. Lett., 52, 85 (2002).
15. C. T. J. Low, R. G. A. Wills and F. C. Walsh, Surface Coating Tech., 201, 371-383 (2006).
16. R. E. Davilla-Martinez, L. F. Cueto and E. M. Sanchez, Surface Sci., 600, 3427-3435 (2006).
17. A. Heeran, C. P. Luo, W. Henschel, M. Fleischer and D. P. Kern, Microelectr. Eng., 84, 1706-1709 (2007).
18. J. Steinbach and H. Ferkel, Acta Mater., 44, 1813 (2001).
19. Y. Chen and D. D. Dionysiou, MoL Catal. A, 244, 73-82 (2006).
20. B. Yu and S. B. Khoo, Electrochem. Comm., 4, 737-742 (2002).
21. A. Panda and E. J. Podlaha, Electrochem. and Solid-State Lett., 31 [4], C149 (2001).
22. J. I. Hamagami, Y. Ato and K. Kanamura, J. Ceram. Soc. Japan, 114[1], 51-54 (2006).
23. M. Boehmer, Langmuir, 12[24], 5747-5750 (1996).