![]() |
Volumn 52, Issue 5-6, 2009, Pages 1276-1283
|
Development of a multiple layer vacuum insulation chip
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ATMOSPHERIC PRESSURE;
ATMOSPHERIC STRUCTURE;
CARBON FIBER REINFORCED PLASTICS;
ELECTRON EMISSION;
HEAT CONDUCTION;
METAL REFINING;
METALS;
PAPER;
PROTECTIVE COATINGS;
STRUCTURAL DESIGN;
THERMAL CONDUCTIVITY;
THERMAL INSULATING MATERIALS;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
VACUUM;
DESIGN VALUES;
EFFECTIVE THERMAL CONDUCTIVITIES;
GLASS CHIPS;
HEAT PUMPS;
HOT PLATES;
LAB ON A CHIPS;
LAYER STRUCTURES;
MECHANICAL STRENGTHS;
METAL COATINGS;
MULTIPLE LAYERS;
NANOMETER THICKNESSES;
NUMERICAL CODES;
REASONABLE AGREEMENTS;
VACUUM GAPS;
VACUUM INSULATIONS;
VACUUM LEVELS;
THERMAL INSULATION;
|
EID: 58149483722
PISSN: 00179310
EISSN: None
Source Type: Journal
DOI: 10.1016/j.ijheatmasstransfer.2008.08.028 Document Type: Article |
Times cited : (4)
|
References (18)
|