An inkjet-deposited antenna for 2.4 GHz applications

AEU - International Journal of Electronics and Communications

Volumn 63, Issue 1, 2009, Pages 31-35

  Mäntysalo, Matti ^a   Mansikkamäki, Pauliina ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Additive manufacturing technology; Direct deposition; Inkjet; Printed electronics

Indexed keywords

BANDPASS FILTERS; ELECTRIC LINES; MANUFACTURE; PAPER; POLYMERS; POWER TRANSMISSION; PRODUCTION ENGINEERING; TRANSMISSION LINE THEORY;

ADDITIVE MANUFACTURING TECHNOLOGY; DIRECT DEPOSITION; ELECTRONICS DEVICES; ETCHING TECHNIQUES; FLEXIBLE SUBSTRATES; HIGH FREQUENCIES; IMPEDANCE MATCHING; INKJET; ISM BANDS; LOW PROCESS TEMPERATURES; MANUFACTURING COSTS; MANUFACTURING FLEXIBILITIES; MASS PRODUCTION PROCESSES; METAL THICKNESSES; PATCH ANTENNAS; PRINTED ELECTRONICS; PRINTED PATTERNS; PRINTING TECHNIQUES; RADIATION PROPERTIES; REEL PROCESSES; TEST CASES; TEST SETS; TRANSMISSION LINES;

ANTENNAS;

EID: 58149381552     PISSN: 14348411     EISSN: 16180399     Source Type: Journal    
DOI: 10.1016/j.aeue.2007.10.004     Document Type: Article

References (6)

1. Redinger D., Molesa S., et al. An ink-jet-deposited passive component process for rfid. IEEE Trans Electron Devices 51 (2004) 1978-1983
2. Seung HK, Chung J, et al. Fabrication of multilayer passive and active components on polymer using inkjet printing and low temperature laser processing. Elsevier Science Direct 2006, online.
3. Radivojevic Z, Andersson K, et al. Optimized curing of solver inkjet based printed traces; 2006. p. 163-8.
4. Hideo Imai, Shinji Mizumo, Akira Makabe, Kazuaki Sakurada, Kenji Wada. Application of inkjet printing technology to electro packaging. In: 39th international symposium on microelectronics, San Diego, USA, 2006.
5. Saito H, Matsuba Y. Liquid wiring technology by inkjet printing using nanopaste. In: 39th international symposium on microelectronics, San Diego, USA, 2006.
6. Wang W, Zhang Z. Nano-silver paste with low roasting temperature. In: Sixth international conference on electronic packaging technology, 2005, p. 226-8.