Condensation heat transfer and flow friction in silicon microchannels

Journal of Micromechanics and Microengineering

Volumn 18, Issue 11, 2008, Pages

  Wu, Huiying ^a   Wu, Xinyu ^a   Qu, Jian ^a   Yu, Mengmeng ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONDENSATION; COOLING; EXPERIMENTS; FLOW PATTERNS; FLUID DYNAMICS; FREQUENCY MULTIPLYING CIRCUITS; FRICTION; HEAT EXCHANGERS; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; HYDRAULICS; MICROCHANNELS; NONMETALS; NUSSELT NUMBER; REYNOLDS NUMBER; STEAM; THERMOANALYSIS; TRIBOLOGY; TWO PHASE FLOW;

ANNULAR FLOWS; CONDENSATION HEAT TRANSFERS; COOLING CONDITIONS; COOLING RATES; DIMENSIONLESS CORRELATIONS; EXPERIMENTAL INVESTIGATIONS; FLOW FRICTION CHARACTERISTICS; FLOW FRICTIONS; GEOMETRIC PARAMETERS; HYDRAULIC DIAMETERS; INJECTION FLOWS; MASS FLOW RATES; SILICON MICROCHANNELS; STEAM CONDENSATIONS; TRAPEZOIDAL SILICONS;

STEAM CONDENSERS;

EID: 58149330122     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/11/115024     Document Type: Article

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