Formation of porous intermetallic thick film by Ni-Al microscopic reactive infiltration

Materials Transactions

Volumn 49, Issue 11, 2008, Pages 2723-2727

  Ohmi, Tatsuya ^a   Hayashi, Naoya ^a   Iguchi, Manabu ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

Author keywords

Catalyst support; Intermetallic compound; Microchannel; Microporous structure; Microreactor; Nickel aluminide; Powder metallurgy; Reactive infiltration; Thick film

Indexed keywords

ALUMINUM; ALUMINUM POWDER METALLURGY; CATALYSIS; CATALYST SUPPORTS; CATALYSTS; INFILTRATION; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); LIGHT METALS; MELTING POINT; METALLURGY; MICROCHANNELS; MICROPOROSITY; NICKEL; NICKEL ALLOYS; NICKEL METALLURGY; POROSITY; POWDER METALLURGY; POWDER METALS; POWDERS; REAL TIME SYSTEMS; SEEPAGE; SEMICONDUCTING INTERMETALLICS; SINTERING; SMELTING; SOIL MECHANICS; SOLDERING ALLOYS; THICK FILMS; WIRE;

INTERMETALLIC COMPOUND; MICROPOROUS STRUCTURE; MICROREACTOR; NICKEL ALUMINIDE; REACTIVE INFILTRATION;

NICKEL POWDER METALLURGY;

EID: 58149250640     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MER2008188     Document Type: Article

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