Limits to the integration of filters and lenses on thermoelectric IR detectors by flip-chip techniques

Sensors and Actuators, A: Physical

Volumn 149, Issue 1, 2009, Pages 65-73

  Fonollosa, J ^a,c   Carmona, M ^c   Santander, J ^b   Fonseca, L ^b   Moreno, M ^a   Marco, S ^a,c  

^a UNIVERSITY OF BARCELONA   (Spain)

^b INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^c INSTITUTE FOR BIOENGINEERING OF CATALONIA IBEC   (Spain)

Author keywords

Assembly; FEM simulation; Fresnel lenses; Infrared filter; Infrared sensor; Optimization

Indexed keywords

DETECTORS; ELECTRIC BATTERIES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INFRARED DEVICES; LENSES; OPTICAL INSTRUMENT LENSES; OPTICAL INSTRUMENTS; OPTICAL SENSORS; OPTIMIZATION; SENSORS; TERNARY SYSTEMS; THERMOPILES;

DEGRADED PERFORMANCES; DETECTOR MODULES; DETRIMENTAL EFFECTS; FEM SIMULATION; FRESNEL LENSES; IN VACUUMS; INFRARED FILTER; INFRARED SENSOR; IR DETECTORS; IR FILTERS; IR SENSORS; MAIN PARAMETERS; NARROW BANDS; OUTPUT RESPONSES; PHYSICAL SIMULATIONS; SOLDER JOINTS; THERMAL COUPLINGS; VALIDATED MODELS;

INFRARED DETECTORS;

EID: 58149181384     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2008.10.008     Document Type: Article

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