Influence of solder paste components on rheological behaviour

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1135-1140

  Mallik, S ^a   Schmidt, M ^b   Bauer, R ^b   Ekere, N N ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b UNIVERSITY OF APPLIED SCIENCES DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CEMENTS; COLLOIDS; CREEP; ELECTRONIC EQUIPMENT MANUFACTURE; HYDRODYNAMICS; INTEGRATED CIRCUITS; METAL RECOVERY; NON NEWTONIAN FLOW; PARTICLE SIZE; PRINTING; PRINTING PRESSES; RHEOLOGY; SHEAR FLOW; SURFACE MOUNT TECHNOLOGY; TESTING; VISCOSITY; VISCOSITY MEASUREMENT; WELDING;

ALLOY COMPOSITIONS; CHARACTERISATION; CREEP AND RECOVERIES; CREEP RECOVERIES; CRITICAL STEPS; EFFECT OF TEMPERATURES; ELASTIC RANGES; ELASTIC REGIONS; FLOW BEHAVIOURS; FLUX COMPOSITIONS; HIGH QUALITY SURFACES; METAL CONTENTS; PRINTING PERFORMANCES; PRINTING PROCESSES; RECOVERY TESTS; RHEOLOGICAL BEHAVIOURS; RHEOLOGICAL PROPERTIES; SMT ASSEMBLIES; SOLDER PASTES; TECHNOLOGY PROCESSES; VISCOSITY TESTS;

YIELD STRESS;

EID: 58149104061     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684512     Document Type: Conference Paper

References (8)

1. Currie, M. A., "Characterisation of solder pastes used in the retlow soldering of surface mount assembly", PhD Thesis (1997), University of Salford. UK.
2. Hwang, J. S., Solder Paste in Electronics Packaging, Van Nostrand Reinhold (New York, 1989), pp. 31-69.
3. Nimmo, K, "Alloy Selecions", In: Lead-free Soldring in Electronics - Science, technology and environmental impact, Marcel Dekker, Inc. (New York 2004), pp 49-90.
4. Anderson, R. et al, "Solder Paste Rheology and Fine Pitch Slump", Journal of Rheology (1995), pp. 12-18.
5. Nguty, T. A. et al, "Correlating Solder Paste Composition with Stencil Printing Performance", Proc Int'l Electronics Manufacturing Technology Symposium, Austin, Texas, October. 1999, pp. 304-309.
6. nd International Electronics Manufacturing Technology Symposium, San Jose, CA, September. 2007, pp. 165-171.
7. st Electronics Systemintegration Technology Conference, Dresden, Germany, September. 2006, pp. 995-1000.
8. Bao, X. et al., "Engineering solder paste performance through controlled stress rheology analysis", Journal of Soldering and Surface Mount Technology, vol.10, No.2 (1998), pp. 26-35.