Development of fine 3-D MID technology using one-shot laser-structuring method

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 670-676

  Kobayashi, Mitsuru ^a   Uchinono, Yoshiyuki ^a   Sato, Masahiro ^a   Zinger, Serge ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TECHNOLOGY; FLIP-CHIP BONDING; HUMAN DETECTION SENSORS; MECHANICAL COMPONENTS; MOLDED INTERCONNECT DEVICES; NUMBER OF COMPONENTS; OPTICAL CONVERTERS; PROCESSING METHOD;

BONDING; CHEMICAL BONDS; LIGHT EMITTING DIODES; MICROELECTRONICS; RESINS; THREE DIMENSIONAL COMPUTER GRAPHICS;

TECHNOLOGY;

EID: 58149096021     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)