Multi-GHZ modeling and characterization of on-chip power delivery network

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 115-118

  Pandit, Vishram S ^a   Ryu, Woong Hwan ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ON CHIPS; POWER GRIDS;

CHIP SCALE PACKAGES; CUSTOMER SATISFACTION; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER TRANSMISSION; ELECTRONICS PACKAGING; POWER ELECTRONICS; POWER GENERATION;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 58049131987     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675891     Document Type: Conference Paper

References (4)

1. Andrey V. Mezhiba and Eby G. Friedman, Fellow, IEEE, "Impedance Characteristics of Power Distribution Grids in Nanoscale Integrated Circuits," IEEE Transactions on VLSI Systems, Vol. 12, No. 11, Nov 2004
2. Jae-Yong Ihm; In Jae Chung; Manetas, G.; Cangellaris, A.C, "Comprehensive Model for On-Chip Power Grid Transient Analysis and Power Grid-Induced Noise Prediction," Electronic Components and Technology Conference, 2005.
3. Mahadevan Suryakumar, Jiangqi He, "Power Delivery Validation of Processor Front Side Bus," Electronic Components and Technology Conference, 2005.
4. Vishram S. Pandit, Woong Hwan Ryu, Sankalp Ramanujam, Kirupa Pushparaj, Farag Fattouh," Simulation and Characterization of GHz on-chip Power Delivery Network," DesignCon 2008