Compact macromodeling of electrically long interconnects

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 199-202

  Chinea, A ^a   Triverio, P ^a   Grivet Talocia, S ^a  

^a POLITECNICO DI TORINO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

COMPACT MACRO MODELS; DO-MAINS; INTER-CONNECTS; MACROMODELING; MACROMODELING ALGORITHMS; MACROMODELS; MODEL COMPLEXITIES; MULTIPLE DELAYS; RATIONAL APPROXIMATIONS; SCATTERING DATUMS; SIMULATION TIMES;

MODEL STRUCTURES;

EID: 58049088457     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675913     Document Type: Conference Paper

References (11)

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9. A. Chinea, P. Triverio, S. Grivet-Talocia, "Delay-Based Macromodeling of Long Interconnects from Frequency-Domain Terminal Responses", 2008, submitted to IEEE Transactions on Advanced Packaging.
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