Electrodeposition of copper on titanium wires: Taguchi experimental design approach

Journal of Materials Processing Technology

Volumn 209, Issue 3, 2009, Pages 1181-1188

  Rosa, J L ^a   Robin, A ^a   Silva, M B ^a,b   Baldan, C A ^a   Peres, M P ^b  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

^b SÃO PAULO STATE UNIVERSITY UNESP   (Brazil)

Author keywords

Adhesion; Copper; Electroplating; Superconducting magnet; Taguchi method; Titanium

Indexed keywords

ACCELERATOR MAGNETS; ADHESION; COPPER; ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; ELECTROMAGNETS; FLOW INTERACTIONS; MAGNETS; REGRESSION ANALYSIS; REINFORCEMENT; SIGNAL TO NOISE RATIO; STATISTICAL METHODS; STATISTICS; SULFURIC ACID; SUPERCONDUCTIVITY; TAGUCHI METHODS; TITANIUM; WIRE;

CATHODIC CURRENT DENSITIES; COPPER LAYERS; COPPER SULPHATE; ELECTRICAL CHARGES; ELECTRICAL CONDUCTIVITIES; ELECTROCOATING; MECHANICAL REINFORCEMENTS; ORTHOGONAL ARRAYS; SIGNAL-TO-NOISE RATIOS; SULPHATE BATHS; SULPHURIC ACIDS; TAGUCHI; TAGUCHI EXPERIMENTAL DESIGNS; TITANIUM SURFACES; TITANIUM WIRES;

SUPERCONDUCTING MAGNETS;

EID: 57949109599     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.03.021     Document Type: Article

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