Interface fracture behavior of electroplated coating on metal substrate under compressive strain

Journal of Materials Processing Technology

Volumn 209, Issue 3, 2009, Pages 1337-1341

  Zhang, Kai ^a   Zhang, Kun ^a   Li, Huai Xue ^a   Chen, Guang Nan ^a  

^a INSTITUTE OF MECHANICS   (China)

Author keywords

Compressive strain; Electroplated coating; Interface fracture; T bend test

Indexed keywords

ADHESION; CEMENTS; CHROMIUM; COATINGS; ELECTROCHEMISTRY; ELECTROPLATING; FRACTURE; SPALLING; SUBSTRATES; TENSILE STRAIN; TESTING;

COATING SYSTEMS; COMPRESSIVE STRAIN; CONVENTIONAL METHODS; ELECTROPLATED COATING; FAILURE BEHAVIORS; INTERFACE CRACKINGS; INTERFACE FRACTURE; INTERFACIAL ADHESIONS; METAL SUBSTRATES; STEEL SUBSTRATES; STEP BY STEPS; T-BEND TEST;

COATED MATERIALS;

EID: 57949098879     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.03.036     Document Type: Article

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