Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines

Journal of Thermal Analysis and Calorimetry

Volumn 94, Issue 3, 2008, Pages 805-815

  Sharma, P ^a   Choudhary, V ^b   Narula, A K ^a  

^a GURU GOBIND SINGH INDRAPRASTHA UNIVERSITY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

4,4 diaminodiphenylsulfone; Curing; DGEBA; Imide amines; Thermal stability

Indexed keywords

ACTIVATION ENERGY; AMINATION; AMINES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; ETHERS; METHANE; MIXTURES; NAPHTHALENE; PHENOLS; RESINS; THERMODYNAMIC STABILITY;

ACTIVATION ENERGY OF DECOMPOSITIONS; AROMATIC IMIDES; CHAR YIELDS; CURING AGENTS; CURING TEMPERATURES; DECOMPOSITION TEMPERATURES; DGEBA; DIAMINODIPHENYL METHANES; DIGLYCIDYL ETHER OF BISPHENOL; DYNAMIC THERMOGRAVIMETRY; EXOTHERM; IMIDE-AMINES; MOLAR RATIOS; NITROGEN ATMOSPHERE.; THERMAL BEHAVIOURS; THERMAL STABILITY;

ORGANIC COMPOUNDS;

EID: 57849150430     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-007-8982-y     Document Type: Conference Paper

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