-
1
-
-
51449101680
-
New generation of passenger vehicles: FCV or HEV?
-
December
-
H. Moghbelli, A. Niasar, H. Abolfazl, and R. Langari, "New generation of passenger vehicles: FCV or HEV?," IEEE International Conference on Industrial Technology, 15-17 December 2006, pp. 452-459.
-
(2006)
IEEE International Conference on Industrial Technology, 15-17
, pp. 452-459
-
-
Moghbelli, H.1
Niasar, A.2
Abolfazl, H.3
Langari, R.4
-
2
-
-
33646516578
-
Power electronics intensive solutions for advanced electric, hybrid electric, and fuel cell vehicular power systems
-
May
-
A. Emadi, S. Williamson, and A. Khaligh, "Power electronics intensive solutions for advanced electric, hybrid electric, and fuel cell vehicular power systems," IEEE Trans. of Power Electronics, vol. 21, no. 3, pp. 567-577, May 2006.
-
(2006)
IEEE Trans. of Power Electronics
, vol.21
, Issue.3
, pp. 567-577
-
-
Emadi, A.1
Williamson, S.2
Khaligh, A.3
-
3
-
-
14644392839
-
The changing automotive environment: High-temperature electronics
-
July
-
R. W. Johnson, J. L. Evans, P. Jacobsen, J. R Thompson, and M. Christopher, "The changing automotive environment: high-temperature electronics," IEEE Trans. on Electronics Packaging Manufacturing, vol. 27, no. 3, pp. 164-176, July 2004.
-
(2004)
IEEE Trans. on Electronics Packaging Manufacturing
, vol.27
, Issue.3
, pp. 164-176
-
-
Johnson, R.W.1
Evans, J.L.2
Jacobsen, P.3
Thompson, J.R.4
Christopher, M.5
-
4
-
-
0036147524
-
Expanding automotive electronic systems
-
January
-
F. Leen and D. Heffernan, "Expanding automotive electronic systems," IEEE Computer, no. 1. pp. 88-93, January 2002.
-
(2002)
IEEE Computer
, Issue.1
, pp. 88-93
-
-
Leen, F.1
Heffernan, D.2
-
6
-
-
0036421990
-
Hightemperature automotive electronics
-
Reno, NV, 10-13 March
-
R. W. Johnson, J. L. Evans, P. Jacobsen, and R Thompson, "Hightemperature automotive electronics," in Proc. Int. Conf. Advanced Packaging and Systems, Reno, NV, 10-13 March, 2002, pp. 77-87.
-
(2002)
Proc. Int. Conf. Advanced Packaging and Systems
, pp. 77-87
-
-
Johnson, R.W.1
Evans, J.L.2
Jacobsen, P.3
Thompson, R.4
-
7
-
-
26144462864
-
The requirement for high-temperature electronics in a future high speed civil transport (HSCT)
-
Charlotte, NC, June
-
C. M. Carlin and J. K. Ray, "The requirement for high-temperature electronics in a future high speed civil transport (HSCT)," in Proc. 2nd Int. High-Temperature Electronics Conf., Charlotte, NC, June 1994, pp. I19-I26.
-
(1994)
Proc. 2nd Int. High-Temperature Electronics Conf
-
-
Carlin, C.M.1
Ray, J.K.2
-
8
-
-
48349096775
-
An SOI-based High-Voltage, High-Temperature Gate-Driver for SiC FET
-
Orlando, Florida, USA, 17-21 June
-
M. Huque, R Vijayaraghavan, M. Zhang, B. Blalock, L. Tolbert and S. Islam, "An SOI-based High-Voltage, High-Temperature Gate-Driver for SiC FET", 38th IEEE Power Electronics Specialist Conference (PESC 07), Orlando, Florida, USA, 17-21 June 2007.
-
(2007)
38th IEEE Power Electronics Specialist Conference (PESC 07)
-
-
Huque, M.1
Vijayaraghavan, R.2
Zhang, M.3
Blalock, B.4
Tolbert, L.5
Islam, S.6
-
9
-
-
0038426995
-
High-temperature electronics-role for wide bandgap semiconductors?
-
June
-
P. G Neudeck, R S. Okojie, and L. Y. Chen, "High-temperature electronics-role for wide bandgap semiconductors?," Proc. of IEEE, vol. 90, no. 6, June 2002, pp. 1065-1076.
-
(2002)
Proc. of IEEE
, vol.90
, Issue.6
, pp. 1065-1076
-
-
Neudeck, P.G.1
Okojie, R.S.2
Chen, L.Y.3
-
10
-
-
10844269580
-
SOI for hostile environment applications
-
4-7 October
-
J. P. Colinge, "SOI for hostile environment applications," IEEE International SOI Conference, 4-7 October 2004, pp. 1-4.
-
(2004)
IEEE International SOI Conference
, pp. 1-4
-
-
Colinge, J.P.1
-
11
-
-
0029464352
-
0.25 μm low power CMOS devices and circuits from 8 inch SOI materials
-
October
-
B. A. Chen, A. S. Yapsir, S. Wu, R Schulz, D. S. Yee, D. K. Sadana, H. J. Hovel, T. H. Ning, G. Shahidi, and B. Davari, "0.25 μm low power CMOS devices and circuits from 8 inch SOI materials," International Conference on Solid-State and Integrated Circuit Technology, 24-28 October 1995, pp. 260-262.
-
(1995)
International Conference on Solid-State and Integrated Circuit Technology, 24-28
, pp. 260-262
-
-
Chen, B.A.1
Yapsir, A.S.2
Wu, S.3
Schulz, R.4
Yee, D.S.5
Sadana, D.K.6
Hovel, H.J.7
Ning, T.H.8
Shahidi, G.9
Davari, B.10
-
12
-
-
1442329113
-
A gate drive circuit for Silicon Carbide JFET
-
Roanoke VA, USA, 2-6 November
-
th Annual Conference of the IEEE Industrial Electronics Society, Roanoke (VA), USA, 2-6 November 2003, pp. 1162-1166.
-
(2003)
th Annual Conference of the IEEE Industrial Electronics Society
, pp. 1162-1166
-
-
Mino, K.1
Herold, S.2
Kolar, J.W.3
-
14
-
-
33947630139
-
A simple, low cost gate drive method for practical use of SiC JFETs in SMPS
-
September
-
th European conference on Power Electronics and Applications, Dresden, Germany, 12-14 September 2005, pp. P1-P6.
-
(2005)
th European conference on Power Electronics and Applications, Dresden, Germany, 12-14
-
-
Melkonyan, A.1
Hofsajer, I.2
Round, S.3
Kolar, J.4
-
15
-
-
33745891203
-
A SiC JFET Driver for a 5 kW, 150 kHz Three-Phase PWM Converter
-
2-6 October
-
S. Round, J. Kolar, I. Hofsajer, and P. Friedrichs, "A SiC JFET Driver for a 5 kW, 150 kHz Three-Phase PWM Converter," IEEE Industry Applications Conference, 2-6 October 2005, pp. 410-416.
-
(2005)
IEEE Industry Applications Conference
, pp. 410-416
-
-
Round, S.1
Kolar, J.2
Hofsajer, I.3
Friedrichs, P.4
-
16
-
-
0036072592
-
A low loss high-frequency halfbridge driver with integrated power devices using EZ-HV SOI technology
-
March
-
F. Li, D. Giannopoulos, and I. Wacyk, "A low loss high-frequency halfbridge driver with integrated power devices using EZ-HV SOI technology," IEEE Applied Power Electronics Conference and Exposition, 10-14 March 2002, pp. 1127-1132.
-
(2002)
IEEE Applied Power Electronics Conference and Exposition, 10-14
, pp. 1127-1132
-
-
Li, F.1
Giannopoulos, D.2
Wacyk, I.3
-
17
-
-
48349138149
-
A high-voltage half-bridge in 1.2μm CMOS process,
-
MSc Thesis, School of Electrical Engineering and Computer Science, Washington State University, December
-
Travis W. Johnson, "A high-voltage half-bridge in 1.2μm CMOS process," MSc Thesis, School of Electrical Engineering and Computer Science, Washington State University, December 1998.
-
(1998)
-
-
Johnson, T.W.1
-
18
-
-
33646875869
-
Microelectronic materials
-
Bristol, U. K, Hilger
-
C. R M. Grovenor, "Microelectronic materials," in Graduate Student Series in Materials Science and Engineering, Bristol, U. K.: Hilger, 1989, pp. 250-263.
-
(1989)
Graduate Student Series in Materials Science and Engineering
, pp. 250-263
-
-
Grovenor, C.R.M.1
-
19
-
-
20544447931
-
Modeling and Simulation of Single and Interleaved Converters Using Silicon-on-Insulator LDMOSFETs,
-
M. S Thesis, ECE Department, University of Idaho, Moscow, Idaho, December
-
K. M. Buck, "Modeling and Simulation of Single and Interleaved Converters Using Silicon-on-Insulator LDMOSFETs," M. S Thesis, ECE Department, University of Idaho, Moscow, Idaho, December 2002.
-
(2002)
-
-
Buck, K.M.1
|