Formaldehyde-free aminoresin wood adhesives based on dimethoxyethanal

Journal of Applied Polymer Science

Volumn 110, Issue 6, 2008, Pages 3908-3916

  Despres, A ^a,b   Pizzi, A ^b   Vu, C ^a   Pasch, H ^c  

^a Usine de Lamotte   (France)

^b Ecole Nationale Supérieure des Technologies et Industries du Bois   (France)

^c FRAUNHOFER INSTITUTE FOR STRUCTURAL DURABILITY AND SYSTEM RELIABILITY LBF   (Germany)

Author keywords

Adhesives; Boards; Formaldehyde free; Panels; Synthetic resins; Urea dymethoxyethanal resins

Indexed keywords

ACIDS; ADDITION REACTIONS; ADHESION; ADHESIVES; ALDEHYDES; CONDENSATION; DESORPTION; DIMERS; EMISSION SPECTROSCOPY; FORMALDEHYDE; MASS SPECTROMETRY; MELAMINE FORMALDEHYDE RESINS; METABOLISM; MOLECULES; NUCLEAR MAGNETIC RESONANCE; OLIGOMERS; POLYMERS; RESINS; STANDARDS; SYNTHETIC FUELS; UREA; WOOD PRODUCTS;

ADHESIVE RESINS; ALDOL CONDENSATIONS; BOARDS; EXCELLENT PERFORMANCES; FORMALDEHYDE EMISSIONS; GLYOXYLIC ACIDS; LASER DESORPTION/IONIZATION; LINKING REACTIONS; MASS SPECTROSCOPIES; MECHANICAL STRENGTHS; NON VOLATILES; PANELS; SYNTHETIC RESINS; UF RESINS; WOOD ADHESIVES; WOOD CHIPS;

UREA FORMALDEHYDE RESINS;

ADHESIVES; CONDENSATION; DIMERS; EMISSION SPECTROSCOPY; FORMALDEHYDE; METABOLISM; OLIGOMERS; PANELS; SORPTION; UREA; WOOD; WOOD PRODUCTS;

ADHESIVE PROPERTY; CATALYST; CONDENSATION; CROSS LINKING; FORMALDEHYDE; RESIN;

EID: 57749199745     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.28936     Document Type: Conference Paper

References (24)

1. Amaral-Labat, G. A.; Pizzi, A.; Goncalves, A. R.; Celzard, A.; Rigolet, S. J Appl Polym Sci 2008, 108, 624.
2. Ballerini, A.; Despres, A.; Pizzi, A. Holz Roh Werkst 2005, 63, 477.
3. El Mansouri, N.-E.; Pizzi, A.; Salvadó, J. J Appl Polym Sci 2007, 103, 1690.
4. Lei, H.; Pizzi, A.; Du, G. J Appl Polym Sci 2008,107, 203.
5. Liu, Y.; Li, K. Int J Adhes Adhes 2007, 27, 59.
6. Prestifilippo, M.; Pizzi, A.; Norback, H.; Lavisci, P. Holz Roh Werkst 1996, 54, 393.
7. Pizzi, A.; Meikleham, N.; Dombo, D.; Roll, W. Holz Roh Werkst 1995, 53, 201.
8. Pichelin, F.; Nakatani, M.; Pizzi, A.; Wieland, S.; Despres, A.; Rigolet, S. Forest Prod J 2006, 56, 31.
9. Wescott, J. M.; Frihart, C. R.; Lorenz, L. Durable soy-based adhesives, in Proceedings of Wood Adhesives 2005, Forest Products Society, Madison, Wisconsin, 2006.
10. Zanetti, M.; Pizzi, A. Holz Roh Werkst 2004, 62, 445.
11. Pizzi, A. Wood Adhesives: Chemistry and Technology; M. Dekker: New York, 1983.
12. Mansouri, H. M.; Pizzi, A. J Appl Polym Sci 2006, 102, 5131.
13. Wang, S.; Pizzi, A. Holz Roh Werkst 1997, 55, 9.
14. Despres, A. PhD Thesis, ENSTIB, University Henri Poincaré Nancy 1, Epinal, France, 2006.
15. Clariant. Highlink DM: A Non Toxic Agent to Produce Formaldehyde-Free Aminoplast Cross-Linkers; Clariant: France, 2002.
16. Mougin, N. U.S. Pat. 0180,019, 2004.
17. European Norm EN 120. Wood-Based Panels: Determination of Formaldehyde Content-Extraction Method Called the Perforator Method; European Committee for Standardization: Brussels, 1992.
18. Despres, A.; Pizzi, A.; Delmotte, L. J Appl Polym Sci 2006, 99, 589.
19. Wieland, S.; Pizzi, A.; Hill, S.; Grigsby, W.; Pichelin, F. J Appl Polym Sci 2006, 100, 1624.
20. European Norm EN 312. Particleboard-Specifications; European Committe for Standardization: Brussels, 1996.
21. Vu, C.; Pizzi, A.; Despres, A. Wipo Patent WO 099,156 [assignee Clariant (France)], 2007.
22. Pizzi, A.; Valenzuela, J.; Westermeyer, C. Holzforschung 1993, 47, 69.
23. Pizzi, A.; Walton, T. Holzforschung 1992, 46, 541.
24. Japanese Standards Association (JIS). Particleboards. JIS A 5908. JIS: Tokyo, Japan, 1994.