Double thick copper BEOL in advanced HR SOI RF CMOS technology: Integration of high performance inductors for RF front end module

Proceedings - IEEE International SOI Conference

Volumn , Issue , 2008, Pages 137-138

  Pastore, C ^a   Gianesello, F ^a   Gloria, D ^a   Serret, E ^a   Bouillon, P ^a   Rauber, B ^a   Benech, Ph ^b  

^a STMICROELECTRONICS   (France)

^b IMEP LAHC   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COPPER;

COPPER METALS; CURRENT CAPABILITIES; HIGH CURRENTS; HIGH PERFORMANCE INDUCTORS; MEASUREMENT RESULTS; METALLIZATIONS; MODULE DESIGNS; ON CHIPS; PASSIVE COMPONENTS; QUALITY FACTORS; RADIO FREQUENCIES; RF CMOS; RF FRONT ENDS; SOI CMOS;

TECHNOLOGY;

EID: 57749181543     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2008.4656332     Document Type: Conference Paper

References (8)

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