New equipment and approaches for fabrication of uniformly-dispersed nanoclay cluster/epoxy composites

Polymers and Polymer Composites

Volumn 16, Issue 8, 2008, Pages 555-559

  Chan, Mo Lin ^a   Lau, Kin Tak ^a   Ho, Mei Po ^a   Cheng, Alvin ^b   Wong, Tsun Tat ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b CHEMATCO Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

MEMS; MICROHARDNESS;

ENGINEERING APPLICATIONS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MINIATURIZATION OF DEVICES; NANO ELECTROMECHANICAL SYSTEMS; POLYMER COMPOSITE; STRENGTH INCREMENTS; TEMPERATURE ENVIRONMENTS; THERMAL AND ELECTRICAL PROPERTIES;

NANOCOMPOSITES;

EID: 57749106519     PISSN: 09673911     EISSN: 14782391     Source Type: Journal    
DOI: 10.1177/096739110801600809     Document Type: Article

References (7)

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2. Bagherzadeh M.R. and Mahdavi F., Preparation of epoxy-clay nanocomposite and investigation on its anti-corrosive behavior in epoxy coating, Progress in Organic Coatings, 60 (2007) 117-120.
3. Gintert M.J., Jana S.C. and Miller S.G., A novel strategy for nanoclay exfoliation in thermoset polyimide nanocomposite systems, Polymer, 48 (2007) 4116-4173.
4. Lei S.G., Hoa S.V. and Ton-That M.T., Effect of clay types on the processing and properties of polypropylene nanocomposites, Composites Science and Technology, 66 (2006) 1274-1279.
5. Dean K., Yu L. and Wu D.Y., Preparation and characterization of melt-extruded thermoplastic starch/clay nanocomposites, Composites Science and Technology, 67 (2007) 416-421.
6. Regel L.L. and Wilcox W.R., Materials Processing in High Gravity, Plenum Press, New York, 1994, Chapter1:p.2.
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