Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Volumn , Issue , 2008, Pages 64-69

  Turowski, Marek ^a   Dooley, Steven ^b   Raman, Ashok ^a   Casto, Matthew ^b  

^a CFD RESEARCH CORPORATION   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

Layout; Modeling; Simulation; Temperature; Three dimensional

Indexed keywords

INTEGRATED CIRCUIT DESIGN; MODELS; TEMPERATURE; TEMPERATURE MEASUREMENT; THERMOANALYSIS; THREE DIMENSIONAL COMPUTER GRAPHICS; TIMING CIRCUITS; TRANSISTORS;

3D THERMAL ANALYSIS; INFRARED TEMPERATURE MEASUREMENTS; LAYOUT; MULTI-SCALE MODELING; NUMERICAL TECHNIQUES; SIMULATION; SINGLE TRANSISTORS; THREEDIMENSIONAL (3-D);

ANALOG INTEGRATED CIRCUITS;

EID: 57649208446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2008.4669880     Document Type: Conference Paper

References (8)

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