Study of wetting properties of Ti/TiN liners deposited by Ion Metal Plasma PVD for low temperature, sub 0.25um Al fill technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3214, Issue , 1997, Pages 79-83

  Hui, Simon ^a   Ngan, Ken ^a   Narasimhan, Murali ^a   Hogan, Barry ^a   Yao, Gongda ^a   Ramaswami, Sesh ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

Al planarization; Film morphology and texturing; Ion Metal Plasma

Indexed keywords

AL PLANARIZATION; ALUMINUM FILMS; EXPERIMENTAL INVESTIGATIONS; FILM MORPHOLOGY AND TEXTURING; GRAIN SIZES; HIGH REFLECTIVITIES; HIGH TEMPERATURES; IC PROCESSES; INTEGRATED PROCESSES; LOW TEMPERATURES; PLANARIZATION PROCESSES; PROCESS PRESSURES; PROCESS TEMPERATURES; PVD PROCESSES; TI/TIN FILMS; TI/TIN UNDERLAYERS; WETTING LAYERS; WETTING PROPERTIES;

ALUMINA; CRYSTAL ORIENTATION; HARD FACING; IONS; METALLIC FILMS; METALS; MORPHOLOGY; PLASMAS; REFLECTION; SURFACE ROUGHNESS; TECHNOLOGY; TEXTURING; TIN; TITANIUM COMPOUNDS; TITANIUM NITRIDE; WETTING;

ALUMINUM;

EID: 57649167178     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284653     Document Type: Conference Paper

References (3)

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2. Y. Tanaka, P. Gopalraja, T. Tanimoto, J. Forster, Z. Xu, Proc. VMIC 1997 p. 437
3. Z. Xu, K. Ngan, J. VanGogh, R. Mosely, Y. Tanaka, H. Kieu, F. Chen, I. Raaijmakers, Proc. SPIE 1994