Computer vision techniques for IC wire-bond height inspection

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3185, Issue , 1997, Pages 11-21

  Koh, Liang Mong ^a   Lim, Han Ooi ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Computer vision; Focus estimation; Range height measurement; Wire bond

Indexed keywords

COMPUTER VISION; CUSTOMER SATISFACTION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; IMAGE ENHANCEMENT; IMAGE PROCESSING; INSPECTION; INSTRUMENTS; INTEGRATED CIRCUITS; QUALITY ASSURANCE; QUALITY FUNCTION DEPLOYMENT; SPHERES; TOTAL QUALITY MANAGEMENT;

COMPUTER VISION TECHNIQUES; DIFFERENTIAL METHODS; ELECTRICAL INTEGRITIES; FOCUS INDICES; FOURIER ENERGIES; GRADIENT IMAGES; HEIGHT MEASUREMENTS; IC CHIPS; MECHANICAL INTEGRITIES; RANGE/HEIGHT MEASUREMENT; SILICON CHIPS; STRUCTURE LIGHTINGS; WIRE BONDINGS;

WIRE;

EID: 57649114154     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284035     Document Type: Conference Paper

References (7)

1. H. Lim, "Computer Vision Approaches For Automatic Inspection of Wire bonding of Semiconductor Devices", M. Eng. Thesis, Nanyang Technological University, 1996.
2. A. Pentland, "A new sense for depth of field", IEEE Trans, on PAMI, pp525-31, 1987.
3. B. K. P. Horn, "Focusing", MIT Artificial Intelligence Laboratory Memo No. 160, May 1968.
4. T. Durrel and K. Wolin, "Pyramid based depth from focus", IEEE Conf. On Computer Vision and Pattern Recognition, pp504-509, 1988.
5. E. Krotkov, "Focusing", International Journal of Computer Vision, pp223-37, 1987.
6. M Subbarao, T. Choi, "Accurate Recovery of three-dimensional shape from image focus", IEEE Trans, on PAMI, pp266-74, March 1995.
7. th Ed.", pp 818-820, John Wiley, 1983.