Diode laser systems for cutting applications of thin materials

ICALEO 2003 - 22nd International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Volumn , Issue , 2003, Pages

  Knitsch, Alexander ^a   Seme, Bernd ^a   Hoffmann, Dieter ^a   Petring, Dirk ^a   Loosen, Peter ^a   Poprawe, Reinhart ^a   Iffländer, Reinhard ^b  

^a FRAUNHOFER INSTITUTE FOR LASER TECHNOLOGY   (Germany)

^b TRUMPF Laser AG   (Germany)

Author keywords

Cutting applications; High power diode laser; Polarization multiplexing; Wavelength multiplexing

Indexed keywords

DIODES; FITS AND TOLERANCES; OPTICAL BEAM SPLITTERS; POLARIZATION; SEMICONDUCTOR LASERS;

BEAM PARAMETER PRODUCT; BROAD AREA DIODE LASERS; HIGH POWER DIODE LASER; MANUFACTURING TOLERANCES; OPTICAL OUTPUT POWER; POLARIZATION BEAM SPLITTERS; POLARIZATION MULTIPLEXING; WAVELENGTH MULTIPLEXING;

LASER MIRRORS;

EID: 57349140967     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2351/1.5060033     Document Type: Conference Paper

References (7)

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7. A. Knitsch et al., "Diode laser modules of highest brilliance for materials processing", Photonics West 2002, San Jose, USA, Jan 19-25, 2002, SPIE Vol. 4651 (2002)